Master Bond Product Search

178 products match

EP38FLAO Two Component Epoxy EP38FLAO

Highly flexible. Thermally conductive/electrically insulative. Excellent flowability. Well suited for potting and encapsulation. Withstands rigorous thermal cycling and shocks. Low exotherm. Long working life. One to one mix ratio by weight or volume. Serviceable from -100°F to +250°F.

EP39MAOHT Two Part Epoxy System EP39MAOHT

Thermally conductive, low viscosity potting/encapsulation compound. Superior dielectric properties. Versatile cure schedules. Convenient one to one mix ratio weight or volume. Minimal shrinkage and stress development. Resists thermal cycling and mechanical shocks. Service temperature range -100°F to +400°F.

EP3ANHT One Part Epoxy EP3ANHT

Heat resistant thermal conductive epoxy for potting and bonding. No mix system. 100% reactive. Thermal conductivity 23 BTU in/ft2/hr/°F. Gel time 90-100 seconds at 150°C. Volume resistivit <1015 ohm-cm. Offers protection against abrasion and thermal cycling. Serviceable from -60°F to +400°F.

EP3AOHT One Part Epoxy EP3AOHT

Light paste. One component, no mix system. Thermally conductive/electrically insulative. Service temperature range -60°F to +400°F. Flexible cure schedules. Cost effective.

EP3AOHTLV One Component Epoxy EP3AOHTLV

Single component thermally conductive/electrically insulative epoxy for bonding/potting. Heat resistant. Fast curing. Offers excellent adhesion to metallic and nonmetallic substrates. Serviceable from -60°F to +400°F.

EP3HTN One Part Epoxy EP3HTN

Nickel filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F.

EP3HTS One Part Epoxy EP3HTS

Silver filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F.

One Component Epoxy Compound EP3HTS-LO

High performance, one component silver filled electrically conductive adhesive. Low volume resistivity. Bonds wells to a wide range of substrates. Meets NASA low outgassing requirements. Thermally conductive. Rapid cures at moderate temperatures. Easy to dispense. Serviceable from -60°F to +400°F.

One Part, Silver Filled Epoxy EP3HTS-TC EP3HTS-TC

Silver filled electrically conductive, for die attach and general bonding. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Thixotropic paste, consistency. Available in syringes that are compatible with various types of automatic dispensers or manual dispensing. Serviceable from -80°F to +400°F.

EP3HTSCN One Part Epoxy EP3HTSCN

Silver coating nickel filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F.

Pages