Expanded Product List
Master Bond Product Search
430 products match
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EP19HTLV Ultra low viscosity, thermally stable high performance system. Tg 125-130°C. Resists water, oils, fuels and most solvents. Superior adhesion to metal and ceramics. "Unlimited" working life at room temperature. Serviceable up to 400°F. Ideal for impregnation of porous surfaces. |
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EP19HTLV-2 Viscosity 200-700 cps. One part system has "unlimited" working life at room temperature. Impressive physical strength properties. Sprayable or brushable. Chemical resistant. Excellent thermal stability. Serviceable from -60°F to +400°F. |
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EP21 Moderate viscosity room temperature curing epoxy adhesive, sealant, coating, encapsulant. Convenient one to one mix ratio, weight or volume. Mix ratio can be altered to give a more rigid or flexible cure. High strength system. Withstands exposure to many chemicals. Reliable electrical insulator. Serviceable from -60°F to +250°F. |
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EP21AC Two part epoxy that is UL tested as per Standard 746A, formulated to optimize arc resistance. Bonds well to variety of substrates. Durable, tough, high strength. Resists thermal cycling. One to one mix ratio by weight. Flowable. Serviceable from -60°C to +90°C. Excellent electrical insulator. Non-halogenated system. |
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EP21AR Two part, room temperature curable epoxy system with superior resistance to inorganic acids. Low viscosity. Used for bonding, sealing, coating, encapsulation. Serviceable from -60°F to +250°F. 100% reactive compound. Excellent dielectric strength. Especially noteworthy is its resistance to sulfuric and hydrochloric acids. |
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EP21ARHT Serviceable from +400°F. Exceptional acid resistance. Cures at room temperature. Good flow properties. 100% reactive. Low shrinkage upon cure. |
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EP21ARHTND Non-drip paste. Exceptional chemical resistance to acids. High bond strength. 100 to 50 mix ratio by weight. Formulated to cure at ambient temperatures. Used for coating pumps, storage vessels, tanks. Serviceable from -60°F to +400°F. |
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EP21ARHTND-2 Non-drip paste. Exceptional chemical resistance to acids. High bond strength. 100 to 50 mix ratio by weight. Formulated to cure at ambient temperatures.Serviceable from -60°F to +400°F. |
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EP21ARLV Two part, room temperature curable epoxy system with superior resistance to inorganic acids. Low viscosity. Used for bonding, sealing, coating, encapsulation. Serviceable from -60°F to +250°F. 100% reactive compound. Excellent dielectric strength. Especially noteworthy is its resistance to sulfuric and hydrochloric acids. |
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EP21BAS Two component, room temperature curing, radiopaque epoxy adhesive, sealant and coating. Employed for medical diagnostic and therapeutic devices. Effective for even 100 KV, px-ray (peak x-ray) machines and higher energy capacities. Convenient one to one mix ratio. High bond strength. Superior electrical insulation properties. Serviceable from -60°F to +250°F. |