Expanded Product List
Master Bond Product Search
609 products match
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Supreme 10AOHT One part, oven cured epoxy system with excellent thermal conductivity and superb resistance to thermal cycling. Primarily used for bonding of heat sinks and sensors where heat transfer is desirable. Serviceable from 4k to +400°F. Convenient processing. |
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Supreme 10AOHT-LO Thermally conductive and electrically insulative, one part epoxy adhesive. Superior toughness and dimensional stability. Bonds are resistant to thermal cycling and many chemicals. Serviceable from 4K to +400°F. NASA low outgassing approved. Withstands 1,000 hours 85°C/85% RH. Impressive physical strength properties. |
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Supreme 10HT One part structural epoxy with high bond strength and excellent adhesion to similar and dissimilar substrates, especially composite materials. Requires oven curing at 250-300°F. NASA low outgassing approved. Serviceable from 4k to +400°F. Tough and durable. 85°C/85% RH resistance. |
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Supreme 10HTCL Single component toughened epoxy adhesive with good flow properties. Resistant to thermal cycling, mechanical vibration/shock. Tensile lap shear strength 2,800-3,000 psi. T-peel strength 25-30 pli. Cures in 60-75 minutes at 250°F, shorter times at higher temperatures. Successfully tested at 1,000 hours 85°C/85% RH. Serviceable from 4k to +400°F. |
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Supreme 10HTF-1 Fast curing one component thixotropic paste epoxy. Excellent bond strength. Superb toughness and durability. Viscosity remains constant with time. Solid chemical resistance. Reliable electrical insulator. Serviceable from 4k to +400°F. |
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Supreme 10HTFL Highly flexible, no mix adhesive. Offers outstanding peel strength. 100% reactive. Superior water and chemical resistance. Successfully tested for 1,000 hours 85°C/85% RH. Withstands rigorous thermal cycling. Serviceable from 4k to +350°F. |
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Supreme 10HTN-NV High peel and shear strength single component nickel filled epoxy adhesive. Thixotropic system. Cost effective electrical conductivity. Resists from 4k to +400°F. |
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Supreme 10HTS Silver filled system with excellent electrical conductivity and high physical strength properties. One part, heat cured (250-300°F) epoxy. Wide range of serviceability from cryogenic temperatures up to +400°F. Meets NASA low outgassing specifications. Can be applied without sagging or dripping, even on vertical surfaces. Volume resistivit <0.006 ohm-cm. Thermally conductive. Shore D hardnes >75. |
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Supreme 11 High shear/peel strength epoxy adhesive. Two component system offers one to one mix ratio by weight or volume. Temperature range from -100°F to +300°F. Resists impact, thermal shock and stress cracking fatigue. Excellent long-term durability. Easy application. |
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Supreme 112 Potting, encapsulation, coating, sealing, impregnation compound. Low viscosity, long working life. Superior physical strength. Serviceable from -80°F to 550°F. |