The following is a news release from Master Bond Inc. You have received it because you are listed as an editor for your publication. Attached to this email is a low resolution version of the photograph that is included in the press kit for this product. High resolution version of this image and files with the body text of this release in Word, HTML and text formats are available at http://www.masterbond.com/newsrelease/ep3rr-80. ----------------------------------------------------------------- FOR IMMEDIATE RELEASE No Mix, Thermally Conductive, Electrically Insulative Epoxy System Cures Rapidly At 80°C Developed for a variety of bonding, sealing, potting and encapsulation applications, Master Bond EP3RR-80 is a one component epoxy that offers user friendly handling. It has a moderate viscosity, good flow properties and an unlimited working life at ambient temperatures. Additionally, this system can be stored at 40-50°F and does not require freezing. Unlike typical one part epoxies, EP3RR-80 will cure in 45-50 minutes at 80°C (175°F), or in 25-30 minutes at 250°F. It features low exotherm while curing enabling it to cure in thicker sections up to and beyond a 1/2 inch deep. This dimensionally stable compound forms high strength bonds to metals, composites, ceramics, glass and many plastics. EP3RR-80 has superb electrical insulation characteristics and delivers a thermal conductivity of 5-6 BTU•in/(ft²•hr•°F) [0.72-0.87 W/(m•K)] at 75°F. Resistance to water, oils, fuels and many other chemicals is outstanding. Service operating temperature range is -100°F to +350°F. This compound is widely employed in the electronic, aerospace, specialty OEM and related industries. It is available for use in syringes as well as standard containers ranging from ½ pints to gallons. Master Bond Flip Chip Adhesives Well suited for flip chip underfill applications, Master Bond EP3RR-80 is a single component compound that cures rapidly at elevated temperatures. It offers thermally conductivity, electrical insulation and dimensional stability. Read more about Master Bond’s flip chip adhesives at http://www.masterbond.com/industries/underfill-encapsulants or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com. Note to Editors: For a full product description, please visit: http://www.masterbond.com/tds/ep3rr-80 Check out new videos on our YouTube channel: http://www.youtube.com/user/MasterBondVideo You can embed any of our videos on your website. CONTACT James Brenner, Marketing Manager Email: jbrenner@masterbond.com Tel: +1-201-343-8983 Fax: +1-201-343-2132 MASTER BOND INC. 154 Hobart Street Hackensack, NJ 07601-3922 Web: www.masterbond.com # # #