---------------------------------- The following is a news release from Master Bond Inc. You have received it because you are listed as an editor for your publication. If you do not wish to receive news releases from us or you are not the proper contact for news releases please email us at newsrelease@masterbond.com. Attached to this email is a low resolution version of the photograph that is included in the press kit for this product. High resolution versions of this image and files with the body text of this release are available at http://www.masterbond.com/mbnr. ---------------------------------- FOR IMMEDIATE RELEASE Thermal Conductive Adhesive has Convenient One to One Mix Ratio HACKENSACK, NJ - Feb 2, 2004 -- Master Bond EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive with a forgiving 1 to 1 mix ratio by weight or volume. Developed by Master Bond Inc., Hackensack, N.J. this compound is extremely versatile and will adhere well to variety of similar and dissimilar substrates. It has a low coefficient of expansion, low shrinkage and superb dimensional stability. It also exhibits superior durability and chemical resistance. EP21AO is easy to apply and is a self leveling paste. It is 100% reactive and does not contain any solvents or volatiles. It has a thermal conductivity of 10BTU/in/ft²/hr/°F and a dielectric strength of >400 volts/mil. Its volume resistivity is >10¹³ ohm cm. EP21AO has a Shore D hardness of >85 and a tensile strength of 5,000psi. Service operating temperature range is -60°F to +250°F. Master Bond EP21AO is available for use in pint, quart, gallon and 5 gallon container kits. CONTACT: James Brenner, Marketing Manager Email: jbrenner@masterbond.com Tel: 201-343-8983 Fax: 201-343-2132 MASTER BOND INC. 154 Hobart Street Hackensack, NJ 07601-3922 Web: www.masterbond.com # # #