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The following is a news release from Master Bond Inc.  You have received it because you are listed as an editor for your publication.  

Attached to this email is a low resolution version of the photograph that is included in the press kit for this product.

High resolution versions of this image and files with the body text of this release are available at http://www.masterbond.com/mbnr.html?nr=ep30fl.

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FOR IMMEDIATE RELEASE


New Flexible, Low Viscosity 
Potting Compound

HACKENSACK, NJ - Feb 4, 2008 -- A new flexible, tough epoxy potting and encapsulation compound called EP30FL has been introduced by Master Bond Inc., Hackensack, NJ.  Master Bond EP30FL has extraordinarily low viscosity and is easy to apply.  It can be used in both thick and thin cross sections.  This compound is 100% reactive and does not contain  any volatiles.  It generates low exotherm during cure even though it cures relatively quickly at room temperature.  Shrinkage upon cure is exceptionally low.

Master Bond EP30FL has excellent adhesion to both similar and dissimilar substrates.  Because of its flexibility it is particularly recommended for use in environments exposed to thermal cycling.  Additionally it can withstand mechanical shock and vibration.  The hardened compound has superior electrical insulation properties and resistance to water.  

Master Bond EP30FL is available in 1/2 pint, pint, quart, gallon and 5 gallon pail kits.



CONTACT:
James Brenner, Marketing Manager
Email: jbrenner@masterbond.com
Tel: 201-343-8983
Fax: 201-343-2132

MASTER BOND INC.
154 Hobart Street
Hackensack, NJ  07601-3922
Web: www.masterbond.com

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