Two component, room temperature curing epoxy for bonding, sealing, coating and encapsulating with low coefficient of thermal expansion
- Thermally and electrically insulating
- Good flow properties
- Low shrinkage upon cure
- Superior dimensional stability
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE). It has a forgiving 100 to 5 mix ratio by weight and cures readily at room temperature or more quickly at elevated temperatures. To obtain optimum properties, a good cure schedule is overnight at room temperature followed by 2-4 hours at 150-200°F. The CTE is extremely low, 10-13 x 10-6 in/in/°C. Additionally, it is highly dimensionally stable and electrically insulative. Very significantly, this epoxy has low linear and volumetric shrinkage upon curing.
EP30LTE-2 bonds well to a wide variety of substrates including metals, glass, ceramics and many rubbers and plastics. It is 100% reactive and does not contain any solvents or diluents. This system offers excellent resistance to many chemicals, such as water, fuels and oils, as well as a number of acids and bases. It is serviceable over the wide temperature range of -100°F to +250°F. Part A of this system is off white in color and Part B is clear. EP30LTE-2 is especially used in aerospace, optical, electronic, specialty OEM and other applications where low shrinkage, an ultra low CTE along with superb dimensional stability are important requirements.
- Relatively easy processing
- 100% reactive
- Good flow properties — well suited for small to moderate sized castings
- Exceptionally high compressive strength
- Meets NASA low outgassing specifications
EP30LTE-2 is available is various sizes and units to accommodate customer's needs.