Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105
Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105
Master Bond Hot Melt MB514 is a high performance hot melt adhesive with the following key features: It is particularly suited for use on untreated surfaces of high and low density polyethylene, polypropylene, ultra-high molecular weight polyethylene and combinations of these substrates. MB514 bonds untreated polyolefins for structural applications. It provides excellent bond performance over the temperature range of -20°F to 190°F (-29°C to 88°C). MB514 is 100% solids and contains no solvents. Bond strengths develop rapidly with no need for clamps or post cure during assembly.
