One component, toughened epoxy system for bonding, sealing, coating and encapsulating
Key Features
- No mixing, convenient handling
- Cures at 175-185°F
- Very good electrical insulation properties
- Well suited for glob top application
Product Description
Master Bond Supreme 3CCM-85 is a toughened, one part epoxy system that can be used for bonding, sealing, coating, and especially glob tops and small encapsulation. First and foremost, the curing temperature for this system is 175-185°F for 2 to 3 hours, rather than the typical curing temperature of 250-300°F for a one part epoxy. This is especially significant because it allows this epoxy to be used in applications where plastic substrates are sensitive to temperatures exceeding 200°F. Supreme 3CCM-85 is not premixed and frozen and its working life is unlimited at room temperature. It has a viscosity and flow profile that is well suited for glob top and other encapsulation applications.
Supreme 3CCM-85 bonds well to a wide variety of substrates used in electronics including metals, composites, ceramics and many plastics. It has very good physical strength properties. The service temperature range for this system is from -100°F to +350°F. This system is capable of transferring heat while retaining its inherent electrical insulation profile. Also, it is a toughened system that can withstand various types of thermal cycling. While it is primarily used as a glob top material it also can be used for potting and bonding. Its color is black. The main use of this epoxy is for applications where heat curing above 200°F is not possible.
Product Advantages
- One part system; no mixing needed
- Very long open time
- Thermally conductive, electrically isolating
- Holds up to aggressive thermal cycling
- Dispenses well for glob top applications
- Cures at 175-185°F
Industrial Certifications
Packaging
Supreme 3CCM-85 is available is various sizes and units to accommodate customer's needs.
