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School is back in session and the subject in this video is low viscosity. Dr. B explains various applications that benefit from adhesive systems with a flowable consistency such as flip chip encapsulation and porosity sealing.
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Versatile, Optically Clear Two Part System |
With a glass transition temperature exceeding 175°C, EP30-3LO combines superior chemical resistance along with passing NASA low outgasing testing requirements. It has an easy to use 100 to 30 mix ratio by weight, and while it requires heat curing, it offers a long open time of 6-10 hours for a 100 gram batch. This product bonds well to a wide variety of substrates including metals, glass, composites and many plastics and rubbers. Electrical insulation properties are outstanding.
For more information, request a technical data sheet on EP30-3LO
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| Optically Clear Epoxy Has High Flexibility |
With a low viscosity, EP37-3FLF is a superb potting, casting, encapsulating and underfill system that is serviceable over the temperature range of 4K to +250°F. As an adhesive, it forms forgiving, high strength bonds that offer excellent impact resistance. It also withstands severe thermal cycling and shock. This room temperature curing system offers a convenient one to one mix ratio by weight or volume. It has a long working life and a low exotherm upon cure.
For more information, request a technical data sheet on EP37-7FLF
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| Low Viscosity, One Component Fast Curing Silicone |
Ideal for smaller encapsulations and conformal coating applications, MasterSil 713 is an easy to use one component silicone with an exceptionally low viscosity. This self leveling system cures rapidly at room temperature and is non-corrosive. Speed of cure depends upon the level of humidity and the thickness of the layer being cured. It can be cured in thicknesses up to ¼ inch deep with superb flexibility and elasticity. MasterSil 713 also offers outstanding electrical insulation properties and is serviceable up to +400°F.
For more information, request a technical data sheet on MasterSil 713
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| Very Low Viscosity Compound for a Variety of Encapsulation Applications |
EP30LV-1 is a two part epoxy system for high performance potting and encapsulation. This compound has outstanding physical strength properties along with excellent electrical insulation characteristics and high dimensional stability. EP30LV-1 bonds well to a variety of substrates while maintaining excellent optical clarity, low shrinkage and chemical resistance. It is widely used in the electronic, electrical, optical and chemical processing industries.
For more information, request a technical data sheet on EP30LV-1
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Optically Clear Epoxy Features a Long Open Time
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Low viscosity, EP62-1LPSP is a two component, heat curing epoxy that features an exceptionally long working life of 12-24 hours at ambient temperatures. Its thin consistency, long open time and low exotherm allows this system to be used for moderate and larger sized electrical encapsulations. This optically clear system has outstanding thermal stability with a service temperature range extending from -60°F to +400°F.
For more information, request a technical data sheet on EP62-1LPSP
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Copyright  2015 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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September 2015
