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It’s time to enroll in Master Bond’s Adhesive Academy, where the innovative Dr. B fills you in on the ins and outs of adhesives. In this episode, he explains the benefits of using heat to cure epoxy systems.
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| Two Part Epoxy System with Good Thermal Conductivity
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Widely used in the electronic, electro-optical and related industries, EP21AOLV-1 features excellent heat transfer and electrical insulation properties. While its primary use is for potting and encapsulating, it is also a superior adhesive that forms high strength bonds. This versatile system will adhere well to a wide variety of substrates including metals, glass, ceramics and many plastics. EP21AOLV-1 offers a low coefficient of thermal expansion, excellent dimensional stability, a high tensile modulus and good compressive strength.
For more information, request a data sheet on EP21AOLV-1
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| Low Outgassing Epoxy Offers Superior Chemical Resistance |
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Serviceable up to 450°F, EP42HT-2LO can withstand exposure to various types of fuels, oils, acids, bases, hydrocarbons and many solvents. EP42HT-2LO is a solid electrical insulator and is castable to thicknesses exceeding 2-3 inches. It is easy to apply and has a convenient 100:50 mix ratio by volume or 100:40 ratio by weight. Additionally, it passes NASA low outgassing specifications.
For more information, request a data sheet on EP42HT-2LO
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| System Features Outstanding Dimensional Stability |
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Master Bond EP121AO is a two component, high performance epoxy resin system ideal for coating, sealing, potting and encapsulation for service up to 450-500°F. It also features impressive thermal conductivity and superior electrical insulation properties. EP121AO cures readily at elevated temperatures to a tough, strong solid with excellent long-term durability and chemical resistance even when exposed to adverse environmental conditions. This compound has a long working life at room temperature.
For more information, request a data sheet on EP121AO
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| High Temperature Resistant Epoxy for Industrial Applications |
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High performance EP46HT-1 offers structural bonds that can withstand temperatures up to 550°F. It has high chemical resistance, is a competent electrical insulator and bonds effectively to dissimilar substrates. EP46HT-1 is widely used in the aerospace, electronic, electrical, computer, metalworking, appliance, automotive and chemical industries, where heat is always part of the equation.
For more information, request a data sheet on EP46HT-1
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Optically Clear Epoxy Passes NASA Low Outgassing Tests
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EP30-2 is a two component epoxy adhesive, sealant and laminating compound. It cures at room temperatures and has a low mixed viscosity. Bonds are rigid. EP30-2 can resist temperatures up to 300°F and is optically clear. NASA low outgassing approved, this compound can withstand exposure to thermal cycling and chemicals. It is also cryogenically serviceable.
For more information, request a data sheet on EP30-2
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Two Part, Silver Filled Epoxy Adhesive Low Volume Resistivity
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Electrically conductive EP21TDCSFL features high bond strength and an exceptional elongation of greater than 60%. Its high flexibility and low shrinkage produce very little stress on sensitive components and substrates. Serviceable from 4K to +250°F, EP21TDCSFL can function even in cryogenic conditions.
For more information, request a technical data sheet on EP21TDSFL
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Copyright  2014 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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September 2014
