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2016 was a standout year for developing new and innovative products. Let’s take a look back on some adhesives, sealants, coating and encapsulation compounds that were released in this past year.
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Supreme 3HTND-2CCM: Toughened Epoxy for Chip Coating Applications |
This thermally conductive, electrically insulative epoxy passes NASA low outgassing tests which allow it to be used in vacuum, aerospace and clean room applications.
For more information, request a technical data sheet on Supreme 3HTND-2CCM
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| EP30-2LB: Meets NASA Low Outgassing Specifications |
This optically clear, two part system blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm.
For more information, request a technical data sheet on EP30-2LB
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| UV22DC80: Nanosilica Filled, Dual Cure Adhesive |
This low viscosity epoxy features exceptional optical clarity with a dual cure mechanism that allows areas not directly exposed to UV light to be fully cured with the addition of heat at 80°C.
For more information, request a technical data sheet on UV22DC80
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EP41S-5: Adhesive Withstands Methylene Cholride
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EP41S-5 has exemplary resistance to a wide array of chemicals, such as acids, bases, alcohols, fuels and many solvents and is widely used for bonding, sealing and coating, as well as encapsulating.
For more information, request a technical data sheet on EP41S-5
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EP3HTS-LO: One Part, Electrically Conductive Epoxy
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Featuring a silver filler, EP3HTS-LO passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries.
For more information, request a technical data sheet on EP3HTS-LO
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Copyright  2016 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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December 2016
