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Advanced compositions feature high bond strength, speedy processing and are engineered to join surfaces with dissimilar coefficients of expansion. This infographic features one part systems that are easy to handle, have unlimited working lives and cure rapidly at 200°F or less. This allows these products to be used for applications involving heat sensitive substrates.
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EP17HT-100: High Temperature Resistant Epoxy Cures at Low Temperatures |
Formulated for potting, encapsulation, bonding and sealing applications, EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates. It exhibits superior thermal conductivity and electrical insulation properties. This moderate viscosity compound is readily flowable and can be cast in sections up to ½ inch thick.
For more information, request a technical data sheet on EP17HT-100
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Supreme 3HT-80: One Part, Toughened Epoxy Cures At 80°C
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Supreme 3HT-80 is a high strength, one component epoxy that features a 45 minute cure at 175°F [80°C] or a 20 minute cure at 250°F [121°C]. It is well suited for bonding heat sensitive substrates in the aerospace, electronic, electrical, computer and optical industries. Supreme 3HT-80 can withstand exposure to vibration, impact and shock, and is serviceable up to +350°F [+177°C]. This 100% reactive compound also passes 1,000 hours 85°C/85% RH testing.
For more information, request a technical data sheet on Supreme 3HT-80
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EP3RR-80: Cures at Temperatures As Low As 175-180°F (80°C) |
Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond 1/2 inch deep. This system has outstanding mechanical strength properties and solid dimensional stability. Its hardness is 80-90 Shore D.
For more information, request a technical data sheet on EP3RR-80
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UV15DC80: One Component Dual Cure UV Formulation
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Addressing “shadowing” issues, UV15DC80 is a dual cure epoxy based system that cures upon exposure to UV light and/or with heat. The heat portion of the cure schedule can be initiated at 80°C rather than at the more common 125°C. It is not oxygen inhibited and has outstanding chemical resistance to many acids, bases, fuels and solvents. This unique adhesive is a superb electrical insulator and bonds well to metals, glass, ceramics and most plastics.
For more information, request a technical data sheet on UV15DC80
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Copyright  2016 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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October 2016
