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June 2015
EP21LVSP6 is well suited for potting and encapsulation applications. It has a desirable combination of a long open time of 3-5 hours, low viscosity of 4,000-6,000 cps and excellent electrical insulation properties. It also features a very low exotherm and can be used for casting deep cross-section thicknesses. This two component epoxy is formulated to cure at room temperature and bonds well to a wide variety of substrates. It has superior physical strength and chemical/water resistant characteristics.

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EP30-4
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This two part epoxy is especially recommended where a thin layer of epoxy needs to cure very rapidly without adding external heat. Films as thin as 0.025 inches can become tack free in under 30 minutes. EP30-4 features a low viscosity with exceptional adhesion to similar and dissimilar substrates. It is optically clear with superior non-yellowing properties. It is also noteworthy for offering low linear shrinkage upon curing.

For more information, request a data sheet on EP30-4
EP21AOLV-2LO
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Combining impressive thermal conductivity of 9-10 BTU•in/ft2•hr•°F with superb electrical insulation properties EP21AOLV-2LO is ideal for potting, bonding, sealing and coating applications. In fact, it can be used in larger potting applications because it has low exotherm when curing. This NASA low outgassing certified system has a low coefficient of thermal expansion, enhanced dimensional stability, a high tensile modulus and first rate compressive strength properties.

For more information, request a data sheet on EP21AOLV-2LO
EP21FL
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Designed for bonding, coating, sealing and encapsulating, Master Bond EP21FL has a low viscosity and cures at room temperature. It features a long working life of 7-8 hours along with a low exotherm while curing. It is a toughened epoxy that is ideal for bonding dissimilar substrates with differing coefficients of expansion. EP21FL can also effectively withstand rigorous thermal cycling and mechanical shock.

For more information, request a data sheet on EP21FL
EP30M4LV
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Chemical resistant Master Bond EP30M4LV is a two component, low viscosity epoxy system for high performance bonding, sealing and encapsulation. EP30M4LV features a low exotherm, which makes it ideal for a variety of moderately sized potting and encapsulation applications. It is serviceable over the wide temperature range of -80°F to +250°F. It is also noteworthy for its superior electrical insulation properties. This system features a forgiving 100 to 60 mix ratio by weight and is 100% reactive. It can withstand exposure to xylene, 70% sulfuric acid, 50% sodium hydroxide and bleach.

For more information, request a data sheet on EP30M4LV
MasterSil 152
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Low viscosity MasterSil 152 is a two component, optically clear silicone system that cures when exposed to air at room temperature. It has outstanding electrical insulation properties, making it ideal for potting and encapsulation applications. Additionally it features a long working life and has a low exotherm. Serviceability is from -65°F to +400°F. This highly flexible compound has a Shore A hardness of 25-35.

For more information, request a data sheet on MasterSil 152

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