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| New White Paper: Epoxies for Space Applications |
Adhesives in space applications are subject to high vacuum and extreme temperatures, making adhesive choice a critical design consideration. Learn how low outgassing epoxies satisfy these stringent conditions and provide protection from impact, vibration and thermal shock.
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NASA Low Outgassing, Adhesive No Mixing |
Cryogenically serviceable Supreme 12AOHT-LO combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable epoxy has formidable bond strength, particularly in the shear mode, exceeding 3,500 psi. Its service temperature range extends from 4K to +500°F. Supreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock.
For more information, request a technical data sheet on Supreme 12AOHT-LO |
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| Dimensionally Stable Epoxy Has Quartz Filler |
NASA low outgassing approved, EP30QF is a quartz filled, two component epoxy for high performance bonding, sealing, coating and casting applications. It is formulated to produce high strength, rigid bonds which are remarkably resistant to chemicals including water, oil and most organic solvents. EP30QF’s linear shrinkage after cure is exceptionally low. It is especially recommended where high tensile modulus, outstanding compressive strength and superior dimensional stability are required.
For more information, request a technical data sheet on EP30QF |
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| B-Staged Film Meets NASA Low Outgassing Requirements |
Master Bond FLM36-LO is a film adhesive featuring excellent thermal conductivity and electrical insulation properties. As a film, it is very easy to handle, offers uniform bond line thickness and limited squeeze out when curing. FLM36-LO retains high physical strength properties at temperatures up to 500°F, while combining enhanced thermal/mechanical shock resistance and thermal cycling capabilities. It differs from other heat resistant epoxies due to its toughness.
For more information, request a technical data sheet on FLM36-LO |
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| Fast Setting, Metal Bonding System |
EP65HT-1 offers the unique combination of ultra fast cures at room temperature and high thermal stability. This two component epoxy sets up in just 3-5 minutes at 75°F and can withstand temperatures up to 400°F. It has a remarkable glass transition temperature of about 125°C. It also meets NASA low outgassing requirements. Available for use in a convenient application gun, this compound features both superior dimensional stability and high tensile strength properties.
For more information, request a technical data sheet on EP65HT-1 |
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| Flame Retardant Epoxy Passes Horizontal Burn Test |
EP90FR-H is a two component high strength epoxy system that complies with FAR standard 14 CFR 25.853(a) for flame retardancy. This moderate viscosity epoxy has excellent strength properties and can be considered for use in specialized applications in aircraft and related assemblies. Some potential uses for this non-halogenated system include baggage equipment areas, aircraft windows and lighting assemblies, among others.
For more information, request a technical data sheet on EP90FR-H |
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| Flexible, Heat Dissipative Silicone Withstands Up To 400°F |
MasterSil 151AO is a two component, low viscosity silicone compound for high performance potting and encapsulation. It combines high temperature resistance, superior flexibility, outstanding thermal conductivity and thermal cycling resistance. This addition cured silicone system cures readily at room temperature and does not require air for complete cross-linking.
For more information, request a technical data sheet on MasterSil 151AO |
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Copyright  2015 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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March 2015
