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| White Paper: Ultra Low Thermal Resistant Adhesives for Electronic Applications |
As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability. As product manufacturers face greater challenges in assembling die, package, and other components into products able to cope with increasing heat loads, adhesives are uniquely qualified to meet these increasingly diverse requirements.
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| MasterSil 151TC: Two Part, Room Temperature Curing Silicone |
Combining high thermal conductivity and fine particle sizes, MasterSil 151TC delivers a low thermal resistance. This addition cured silicone system is primarily used for bonding and small gap filling applications. It has low exotherm and cures in 2-3 hours at 150-200°F or in 2-3 days at room temperature. MasterSil 151TC features excellent flexibility and high temperature resistance up to +400°F.
For more information, request a technical data sheet on MasterSil 151TC |
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| EP48TC: Unsurpassed Heat Transfer Capabilities |
ESpecially formulated, two part epoxy EP48TC has ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as thin as 10-15 microns. It also features high thermal conductivity of 20-25 BTU•in/ft2•hr•°F [2.88-3.60 W/(m•K)]. EP48TC has first rate electrical insulation properties over the wide service temperature range from -100°F to +300°F.
For more information, request a technical data sheet on EP48TC |
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| Supreme 18TC: NASA Low Outgassing, One Part Epoxy |
Supreme 18TC offers both thermal conductivity and electrical insulation properties. It is formulated with a blend of special thermally conductive fillers, which allow this system to be applied in bond lines as thin as 10-15 microns. This epoxy paste is ideal for thermal management applications with low thermal resistance. It is also able to withstand 1,000 hours at 85°C/85% RH.
For more information, request a technical data sheet on Supreme 18TC |
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| EP3HTSDA-2: Silver Filled Epoxy Has Low Volume and Thermal Resistivity |
Fast curing, single component EP3HTSDA-2 features outstanding electrical and thermal conductivity. It offers ultra low thermal resistance of 2-3 x 10-6 K•m2/W and volume resistivity of <0.001 ohm-cm. It has superior physical strength properties and bonds well to many metals, ceramics, plastics, silicon dies and a wide variety of other substrates. This epoxy also passes NASA low outgassing tests.
For more information, request a technical data sheet on EP3HTSDA-2 |
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| EP30TC: Low Thermal Resistance, Room Temperature Curing Epoxy |
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88 W/(m•K)] and can form bond lines as thin as 5-15 microns, resulting in a low thermal resistance of 7-10 x 10-6 K•m2/W. This NASA low outgassing certified system can be used for bonding, coating, sealing and encapsulating for the aerospace, electronic, optical and OEM industries.
For more information, request a technical data sheet on EP30TC |
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Copyright  2017 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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November 2017
