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| New White Paper: Potting Compounds Protect Electronic Circuits |
Potting and encapsulation compounds are designed to completely enclose a component, module or PCB, which effectively shields the unit while providing structural support. Learn about the performance properties of these systems, to uncover the best fit for the design and assembly of your electronic device.
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Two Part Epoxy with Very Low Exotherm |
Suitable for large castings, EP21LVSP6 is a room temperature curing system with a long open time and a low viscosity. This epoxy features a convenient one to one mix ratio and can also be used in bonding, sealing and coating applications. It has very good physical strength properties as well as being an excellent electrical insulator.
For more information, request a technical data sheet on EP21LVSP6 |
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| Flowable, No-Mix LED Curable Polymer System |
Featuring breakthrough LED curing technology, LED401LV will cure completely tack-free when exposed to a light source emitting 405 nm wavelength in sections of 1/8 inch thick and beyond. Once cured, it has impressive physical properties, including outstanding dimensional stability, very good electrical insulation, optical clarity and commendable chemical resistance. Since LED light sources do not generate as much heat as UV ones, LED401LV can be used to bond heat sensitive substrates.
For more information, request a technical data sheet on LED401LV |
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| Thermally Conductive, Electrically Insulative Epoxy |
EP112FLAO-1 is a flexibilized epoxy designed for high performance electrical and electronic applications where good thermal conductivity and electrical isolation is required. This low viscosity, two part system has a long working life and cures readily at elevated temperatures to a tough strong solid with heat resistance up to 500°F. It also offers high dimensional stability, thermal shock/vibration resistance and excellent adhesion to a wide variety of substrates and is NASA low outgassing certified.
For more information, request a technical data sheet on EP112FLAO-1 |
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| Flexible, Heat Dissipative Silicone Withstands Up To 400°F |
MasterSil 151AO is a two component, low viscosity silicone compound for high performance potting and encapsulation. It combines high temperature resistance, superior flexibility, outstanding thermal conductivity and thermal cycling resistance. This addition cured silicone system cures readily at room temperature and does not require air for complete cross-linking.
For more information, request a technical data sheet on MasterSil 151AO |
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| Flexible Epoxy for Potting and Encapsulation Applications
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B-staged epoxy, EP36AO, features outstanding thermal shock resistance and thermal conductivity over the wide temperature range of -80°F to +500°F. It is available for use in 30 gram cookies. EP36AO has excellent adhesion to both metallic and non-metallic substrates, plus a high degree of chemical resistance. It also offers exceptional electrical insulation properties.
For more information, request a technical data sheet on EP36AO |
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| Encapsulation Compound Features Excellent Chemical Resistance |
Well suited for bonding, sealing, casting and potting applications, Master Bond EP30M4 has a moderate viscosity with good flow and outstanding electrical insulation properties. This two part epoxy offers superior resistance to a wide variety of chemicals including water, acids, bases, fuels and oils, along with many aggressive solvents. It cures at room temperature.
For more information, request a technical data sheet on EP30M4 |
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Copyright  2014 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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November 2014
