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New White Paper: Flip Chip Assemblies with Underfill Encapsulants
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Underfill encapsulants are carefully formulated to ensure flowability, an acceptable coefficient of thermal expansion and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.
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Quick Curing Epoxy Offers Superior Chemical Resistance
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Master Bond EP3RRLV is a one part epoxy formulated for high performance potting, encapsulation and underfill applications. This low viscosity adhesive withstands heat and thermal cycling, and is resistant to mechanical vibration and shock. EP3RRLV is widely used for microelectronics assembly and packaging applications where excellent electrical insulation and fast cure times are required.
For more information, request a technical data sheet on EP3RRLV
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Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications
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Master Bond’s EP30AO is a thermally conductive, electrically insulative potting and encapsulation compound that facilitates thermal management by permitting effective heat dissipation from highly populated circuit boards. EP30AO has a low viscosity, cures at room temperatures, has superior dimensional stability and high physical strength. It also resists thermal cycling and long term exposure to chemicals including, water, oils and fuels.
For more information, request a technical data sheet on EP30AO |
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Optically Clear Epoxy Has High Flexibility
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With a low viscosity, EP37-3FLF is a superb potting, casting, encapsulating and underfill system. As an adhesive, it forms forgiving, high strength bonds that offer excellent impact resistance as well as resistance to severe thermal cycling and shock. This room temperature curing system also offers a convenient one to one mix ratio by weight or volume. It has a long working life and a low exotherm upon cure.
For more information, request a technical data sheet on EP37-3FLF |
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Very Low Viscosity Compound for a Variety of Encapsulation Applications
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Master Bond EP30LV-1 is a two part epoxy system for high performance potting and encapsulation. This compound has outstanding physical strength properties along with excellent electrical insulation characteristics and high dimensional stability. EP30LV-1 bonds well to a variety of substrates while maintaining outstanding optical clarity and chemical resistance. It is widely used in the electronic, electrical, optical and chemical processing industries.
For more information, request a technical data sheet on EP30LV-1 |
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Toughened, High Performance Encapsulation Compound
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Featuring a low viscosity, EP38CL is an optically clear two component epoxy that is used for bonding, sealing, coating and encapsulation in optical, aerospace, opto-electronic and specialty OEM applications. It possesses superior impact resistance, thermal cycling capabilities as well as the ability to withstand mechanical shock better than typical epoxies that are higher on the Shore D scale.
For more information, request a technical data sheet on EP38CL |
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Copyright  2014 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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View this email online
May 2014
