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New White Paper: Epoxy Adhesive Films and Preforms for Electronics Manufacturing

If your application involves a large surface to be joined or if squeeze out may pose a problem, you may want to consider film adhesives. These unique epoxies offer many advantages and are often preferred over conventional liquid systems.
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Thermally Conductive, B-Staged Film

Master Bond FLM36 is a film adhesive featuring excellent thermal conductivity and electrical insulation properties. FLM36 retains high physical strength properties at temperatures up to 500°F, while combining enhanced thermal and mechanical shock resistance and thermal cycling capabilities. It differs from other heat resistant epoxies due to its toughness.
For more information, request a technical data sheet on FLM36
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Electrically Conductive, Silver Filled Adhesive Film

High performance silver filled epoxy adhesive film, FL901S features outstanding electrical conductivity, superior mechanical strength and convenient handling. It cures quickly at moderate temperatures and can be used for bonding electronic components onto substrates as well as for applications where EMI/RFI shielding is needed. Preformed shapes are available upon request.
For more information, request a technical data sheet on FL901S

Master Bond B-Staged Adhesives

B-Stage Epoxy Systems

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B-staged epoxies are arguably the most unique members of the epoxy family. They start out as solid systems and users must heat them until they transform into a liquid state. Then they can be applied as a traditional epoxy, requiring further elevated temperatures to fully cure. Despite their preparation, B-staged epoxies offer many advantages and performance benefits.

For more information, read the full article here

Heat Resistant Liquid Flexible Epoxy Resin Composition

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Master Bond EP36CLV is a one component, high temperature resistant, B-staged epoxy that cures with excellent toughness and is far less rigid than typical high temperature resistant epoxies. It is serviceable for temperatures up to 500°F and is used primarily for potting and encapsulation applications.

For more information, request a technical data sheet on EP36CLV

Adhesives That Can Cure Quickly In Thin Bond Line Thicknesses

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Epoxy for Industrial Manufacturing Applications

Two component, room temperature curing Master Bond EP30-4 has a rapid fixturing time in thin sections. This low viscosity, optically clear compound has superior non-yellowing properties. EP30-4 features high bond strength to similar and dissimilar substrates.
For more information, request a technical data sheet on EP30-4
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High Temperature Resistant Silicone System

With an extraordinarily fast non-corrosive cure, Master Bond MasterSil 711 is ideal for bonding, sealing, coating and formed-in-place gaskets applications, especially those involving electronics. It is extremely soft with superb flexibility and elasticity and outstanding electrical insulation properties.
For more information, request a technical data sheet on MasterSil 711
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