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Enhancing Performance of Electronic Applications with Versatile Epoxy Compounds
Learn about the different functions that epoxies perform in the assembly of today’s electronic systems. From nanotechnology to space systems, these versatile compounds are capable of withstanding a wide range of environmental conditions. They provide reliability and longevity for the devices we use in our everyday lives.
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Silver Filled, Fast Curing Epoxy
Well suited for demanding manufacturing applications, EP3HTS is a one part, electrically conductive epoxy system featuring a fast cure schedule of 40-90 minutes at 250°F or 20-40 minutes at 300°F. This silver filled compound has a tensile shear strength over 1,000 psi. Its service temperature range is from -60°F to +400°F.
For more information, request a technical data sheet on EP3HTS
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Toughened B-Staged Adhesive Film
Offering a uniform bond line thickness, Master Bond FLM36 features superior flexibility and toughness, as well as remarkably high strength. This B-staged film even retains its strength profile at elevated temperatures. Additionally, FLM38 has excellent thermal conductivity and solid electrical insulation properties.
For more information, request a technical data sheet on FLM36
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Thermally Stable & NASA Low Outgassing Approved
Serviceable up to 400°F, Supreme 11AOHTLO features exceptional thermal conductivity and electrical insulation properties for high performance bonding and sealing applications. This two part system delivers impressive toughness which enables it to withstand rigorous thermal cycling. It is well suited for bonding dissimilar substrates that have different coefficients of expansion.
For more information, request a technical data sheet on Supreme 11AOHTLO
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Flexible, Optically Clear Two Component Epoxy
With a thin viscosity and a low exotherm, EP37-3FLF is a superb potting, casting and encapsulating system. As an adhesive, it forms forgiving, high strength bonds that offer excellent impact resistance as well as resistance to severe thermal cycling and shock. This room temperature curing system also offers a convenient one to one mix ratio by weight or volume.
For more information, request a technical data sheet on EP37-3FLF
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Excellent Electrical Insulator & High Temperature Resistant to 450°F
Master Bond EP39MHT is a low viscosity formulation that has superior electrical insulation properties. It develops very little heat during curing and is often used for casting thick sections up to several inches as well as thin sections with minimal shrinkage and stress development. This two part epoxy system is capable of withstanding thermal shock and mechanical vibration.
For more information, request a technical data sheet on EP39MHT
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Ideal for Smaller Encapsulations & Conformal Coatings
MasterSil 713 is a self leveling silicone that bonds well to a wide variety of substrates including glass, metals and many plastics. It has a fast set up time. The speed of cure depends upon the level of humidity and the thickness of the layer being cured. This one component system can be cured in thicknesses up to ¼ inch deep with superb flexibility and elasticity.
For more information, request a technical data sheet on MasterSil 713
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Too busy to read our white paper on Enhancing Performance of Electronic Applications with Versatile Epoxy Compounds? We have it available as a podcast so you can listen to it on the go! |
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Copyright © 2013 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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