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| Updated Catalog: Adhesives, Sealants & Coatings for the Electronic Industry |
This 36-page catalog has been recently updated to include even more of Master Bond’s extensive line of epoxies, silicones, polyurethanes, films, silicate based and light curing compounds offering high performance properties. These products provide solutions to PCB assembly, die-attach, conformal coating, surface mount, lid sealing, flip-chip and wire bonding applications.
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| Two Part, Silver Filled Epoxy Adhesive with Low Volume Resistivity |
Electrically conductive EP21TDCSFL features high bond strength and outstanding resistance to thermal cycling. Its high flexibility and low shrinkage produce very little stress on sensitive components and substrates. This easy to handle system can be easily applied and has superb flow properties. Serviceable from 4K to +250°F, EP21TDCSFL can function even in cryogenic conditions.
For more information, request a technical data sheet on EP21TDCSFL |
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| Toughened Epoxy Offers Convenient Processing & Dispensing |
Well suited for die attach applications, Supreme 3HTND-2DA is a single component fast setting epoxy that doesn’t require mixing or freezing. This toughened system has high die shear strength, superior electrical insulation properties, low ionics, an ideal dispensing profile (no tailing or bleed out) and performs well in 85/85 testing. It also passes NASA low outgassing tests.
For more information, request a technical data sheet on Supreme 3HTND-2DA |
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| Epoxy Has Ultra Low Coefficient of Thermal Expansion |
Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. It has outstanding dimensional stability and will bond well to a wide variety of substrates, including metals, composites, ceramics, glass and many plastics. It is also noteworthy for its low linear (less than 0.01%) and volumetric (less than 0.1%) shrinkage. EP42HT-2LTE has a forgiving, non-critical mix ratio of 100 to 50 by volume and after mixing, the consistency is that of a paste with some flow.
For more information, request a technical data sheet on EP42HT-2LTE |
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| Flowable, NASA Low Outgassing Silicone System |
With a tensile strength of 325-425 psi, MasterSil 921-LO offers good adhesion to a wide variety of substrates including metals, composites, ceramics, glass as well as many rubbers and plastics. This one part silicone has a flowable, moderate viscosity that enables it to be well suited for smaller potting and encapsulation applications. Its lower durometer of 25-35 Shore A hardness facilitates its use with sensitive components, particularly electronic and optical ones.
For more information, request a technical data sheet on MasterSil 921-LO |
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| Single Component Heat Dissipative Silicone Compound |
One component MasterSil 705TC is a thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It is well suited for applications that require flexibility and high temperature resistance up to +400°F. It cures readily at ambient temperatures when exposed to atmospheric moisture and is a non-corrosive paste. MasterSil 705TC is also ideal for a variety of applications where a degree of reworkability is desired.
For more information, request a technical data sheet on MasterSil 705TC |
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| LED Curable Adhesive Cures Opaque White |
The uniqueness of LED401 White is its opaque white color which adds a special dimension to light initiated curing systems, since nearly all are either transparent or tinted with dyes. This one part system cures fully tack-free upon exposure to a 405 nm wavelength light source in 15-30 seconds. It features superb dimensional stability, excellent physical strength and has a volume resistivity >1014 ohm-cm.
For more information, request a technical data sheet on LED401 White |
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Copyright  2015 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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October 2015
