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How To Relieve Thermally Induced Stress
Many intricate electronic assemblies are highly sensitive to the effects of temperature excursions, shock and vibration. An effective design strategy for managing thermal stress is to use stress absorbing materials to bond and encapsulate components. Design engineers can learn more about finding ways to minimize or relieve stress in this white paper.
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Thermally Conductive, Electrically Insulating Epoxy
This two part epoxy combines a variety of high performance properties for bonding and sealing applications. First and foremost, Supreme 11AOHT delivers outstanding thermal conductivity and electrical isolation. It also produces bonds with exceptionally high shear and peel strengths of 1,600 psi and 15 pli at 75°F, respectively. This toughened system is able to withstand rigorous thermal cycling over the wide service temperature range of -100°F to +400°F.
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Optically Clear UV Curable System Has Outstanding Flexibility
UV15-7SP4 is a one part, fast curing system with superior non-yellowing properties. Most importantly, it withstands rigorous thermal cycling as well as mechanical and thermal shock. It bonds well to a wide variety of substrates including glass, metals and plastics, such as polycarbonates, acrylics and a number of films, with very little shrinkage upon curing. UV15-7SP-4 offers superb chemical resistance to water, fuels, acids and bases.
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Water Resistant Silicone Offers Excellent Light Transmission Properties
Featuring outstanding electrical insulation properties and a low viscosity, MasterSil 151 is ideal for high performance potting, casting and encapsulation. This flexibilized system also provides superior resistance to vibration and shock as well as high strength and elongation. Serviceable over the wide temperature range of -65°F to +400°F, MasterSil 151 cures at room temperature or faster at elevated temperatures.
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Low Viscosity, Two Part Epoxy Has Remarkable Dimensional Stability
Master Bond EP30LTE is a specialty epoxy featuring an exceptionally low coefficient of thermal expansion. This two component, low viscosity system is 100% reactive and can be used in bonding, coating, sealing and encapsulation applications. It will cure at room temperature or more quickly at elevated temperatures. Additionally, it has good thermal conductivity and is highly electrically insulative.
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Flexibilized Epoxy Cures Rapidly at Room Temperature
Two component Master Bond EP51FL-1 epoxy system can withstand extreme heat and cold, from 4K to 250°F. This adhesive forms strong, flexible bonds that are capable of adhering to dissimilar substrates. It sets up in just 30-40 minutes at ambient temperatures, with a full cure occurring in 24 hours. It is an excellent thermal and electric insulator, and maintains outstanding chemical resistance.
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Copyright © 2013 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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