Serviceable up to 400°F, Supreme 11AOHTLO features exceptional thermal conductivity and electrical insulation properties for high performance bonding and sealing applications. This two part system delivers impressive toughness which enables it to withstand rigorous thermal cycling and makes it particularly well suited for bonding dissimilar substrates.

EP72M3 is an elastomeric modified epoxy for high performance bonding, coating and sealing. The high strength and tough bonds formed by this flexibilized system have exceptional shear and peel strength. Remarkably resistant to thermal cycling and chemicals, EP72M3 is used throughout the electronic, electrical, computer, metalworking, aerospace and OEM type applications.

Master Bond EP21TDCHT is a flexibilized epoxy adhesive that has been specifically designed to bond substrates with different coefficients of expansion and contraction. It is simple to use, cures at room temperatures and is easy to apply. EP21TDCHT offers exceptionally high peel and tensile lap shear strength. It is also a superior electrical insulator and has outstanding dimensional stability.

Featuring an attractive balance of superior shear and peel strengths, Supreme 46HT-2ND2 is a two component, non-drip epoxy for structural bonding. It is suitable for applications where long-term exposure to temperatures from -100°F to +500°F is required. This toughened system produces durable bonds which are resistant to a wide variety of chemicals, including many acids, bases and solvents.

Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to +350°F making it suitable for cryogenic applications. Supreme 10HTFL is 100% reactive, requires no mixing and has an unlimited working life at room temperature. Its elongation is 50%.