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New White Paper: Thermally Conductive Epoxies Optimize Electronic Assemblies
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Selecting the right thermally conductive epoxy can often make or break your application. As component density increases, heat dissipation is essential for long-term reliability of electronic devices. Master Bond’s white paper compiles important considerations for choosing epoxies for efficient thermal management.
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Two Component, Flexible Silicone Withstands 400°F
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MasterSil 151AO is a two component, low viscosity silicone compound for high performance potting and encapsulation. It combines high temperature resistance, superior flexibility, outstanding thermal conductivity and thermal cycling resistance. This addition cured silicone system cures readily at room temperature and does not require air for complete cross-linking.
For more information, request a technical data sheet on MasterSil 151AO
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One Part Epoxy Meets NASA Low Outgassing Specifications
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Offering high strength properties, Supreme 10ANHT-LO is a single component heat curing system that is serviceable over the wide temperature range of 4K to +400°F. This toughened formulation is thermally conductive and electrically insulative. It is also dimensionally stable and withstands rigorous thermal cycling.
For more information, request a technical data sheet on Supreme 10ANHT-LO |
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Urethane Modified Epoxy System Has a Non-Drip Consistency
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With resounding softness and impressive dimensional stability, Super Gel 9AOND is widely used in the aerospace, electronic, optical, electro-optical and other specialty industries. This electrically isolating, thermally conductive compound is easily reworkable and often used for retrieving components. It has low exotherm enabling it to cure many inches in depth if needed.
For more information, request a technical data sheet on Super Gel 9AOND |
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Epoxy System Ideal for High Vacuum Environments
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Certified to meet NASA low outgassing requirements, EP30AN-1 offers room temperature cures and excellent electrical insulation properties for high performance potting, sealing, coating and bonding applications. This low viscosity system has a low coefficient of thermal expansion.
For more information, request a technical data sheet on EP30AN-1 |
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Flexible Epoxy for Potting and Encapsulation Applications
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B-staged epoxy, EP36AO, features outstanding thermal shock resistance and thermal conductivity over the wide temperature range of -80°F to +500°F. It is available for use in 30 gram cookies. EP36AO has excellent adhesion to both metallic and nonmetallic substrates, plus a high degree of chemical resistance.
For more information, request a technical data sheet on EP36AO |
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Low Viscosity and Cryogenically Serviceable
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Formulated to cure at room temperature, EP30FLAO is a two part epoxy that has an attractive balance of performance properties including dimensional stability, high strength, toughness, heat dissipation and electrical insulation. It also has a desirably low coefficient of thermal expansion which makes it an excellent choice for many potting applications.
For more information, request a technical data sheet on EP30FLAO |
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Copyright  2014 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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View this email online
April 2014
