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FLM36: Thermally Conductive, B-Staged Film

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Offering a uniform bond line thickness, Master Bond FLM36 features superior flexibility, toughness, as well as remarkably high strength. This B-staged film even retains its strength profile at elevated temperatures. Additionally, FLM38 has excellent thermal conductivity and solid electrical insulation properties.
For more information, request a technical data sheet on FLM36

EP29LPSP: NASA Low Outgassing Epoxy

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EP29LPSP is a two component, low viscosity epoxy system for bonding, sealing and coating. This epoxy not only functions at temperatures as low as 4K, but also withstands cryogenic shocks. Additionally, it meets NASA low outgassing requirements. EP29LPSP provides superior physical strength, high chemical resistance, excellent electrical insulation and outstanding optical clarity.
For more information, request a technical data sheet on EP29LPSP

EP42HT-2Med: Withstands Multiple Cycles of Medical Sterilization

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Passing USP Class VI testing requirements for biocompatibility, EP42HT-2Med is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material. It features superior high temperature resistance along with outstanding chemical resistance. It is widely used in the assembly of medical devices due to its capability of withstanding repeated cycles of EtO, radiation, autoclaving and chemical sterilants.
For more information, request a technical data sheet on EP42HT-2Med

EP65HT-1: Fast Curing & Withstands Chemicals

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Combining ultra-fast cures and high temperature resistance, Master Bond EP65HT-1 is a two component epoxy that sets up in 3-5 minutes and has a glass transition temperature of 125°C. It features superior electrical insulating properties and strong chemical resistance while meeting NASA low outgassing specifications. This outstanding compound bonds well to a wide variety of substrates and is widely used in the electrical, electronic, appliance, computer, optical, automotive and OEM industries.

For more information, request a technical data sheet on EP65HT-1

EP21FRNS-2: Flame Resistant Epoxy System for Industrial Applications

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EP21FRNS-2 is a two component, room temperature curing, flame retardant epoxy for potting, encapsulating and casting. It offers low smoke generation and contains a non-halogenated filler. It is remarkably resistant to thermal cycling and many chemicals. As per UL 94V.0 specification, this system is serviceable over the wide temperature range of -51°C to 90°C. EP21FRNS-2 is exceptionally durable and tough and features a convenient one to one mix ratio by weight.
For more information, request a technical data sheet on EP21FRNS-2

Supreme 11AOHTLO: Thermally Stable & NASA Low Outgassing Approved

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Serviceable up to 400°F, Supreme 11AOHTLO features exceptional thermal conductivity and electrical insulation properties for high performance bonding and sealing applications. This two part system delivers impressive toughness which enables it to withstand rigorous thermal cycling and makes it particularly well suited for bonding dissimilar substrates.
For more information, request a technical data sheet on Supreme 11AOHTLO

Super Gel 9: Soft, Resilient Sealing & Encapsulation Compound

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Super Gel 9 is a urethane modified epoxy that features unmatched performance properties including dimensional stability, easy repairability and can be cast up to 2-3 inches thick. Its combination of properties enables it to be used for encapsulating sensitive electronic parts and sealing delicate optical components.
For more information, request a technical data sheet on Super Gel 9
Master Bond Inc. 154 Hobart Street, Hackensack, NJ 07601 USA
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