UV24TKLO is a one part UV curable epoxy modified formulation for bonding, sealing and encapsulation. This compound has excellent optical clarity, superb physical strength, superior electrical insulation properties and outstanding chemical resistance. Its low outgassing properties enable this product to be used in a wide array of optical, electro-optical and vacuum applications that until now have not been possible for UV curable systems.

Featuring a convenient one to one mix ratio by weight or volume, EP21NDFG is a two component epoxy with a paste consistency. This room temperature curing system offers outstanding physical properties including dimensional stability, thermal cycling resistance and electrical insulation values. It withstands a wide variety of chemicals, including water, oils, fuels, acids, bases and salts.

USP Class VI approved, EP41SMed is well suited for a variety of uses in medical devices as an adhesive, sealant and coating. It also meets FDA requirements for food compatibility. This epoxy system is very fast curing at room temperature and produces high strength rigid bonds, which are remarkably resistant to chemicals as well as cold sterilants, EtO and gamma radiation. It has a service temperature range of -60°F to + 250°F and exceptionally low linear shrinkage upon cure.

This low viscosity, two component epoxy adhesive has excellent flow and electrical insulation properties, making it ideal for potting, encapsulation and casting applications. Master Bond EP21FRSPLV features durability, toughness and high strength properties. It is resistant to thermal cycling and many chemicals including fuels, lubricants, water, acids, alkalis and salts. As per UL 94V-0 flame resistant specification, it is serviceable over the exceptionally wide temperature range of -51°C to 90°C.

Easy to use, one component MasterSil 709 is well suited for bonding, sealing, coating and formed in place gaskets applications. It is non-corrosive, fast setting and flowable. It can be widely used for many applications, particularly in aerospace and electronics.

Master Bond EP21TCHT-1 is a heat resistant polymer system formulated for high performance bonding and sealing applications. It features high thermal conductivity and superior electrical insulation properties with a service operating temperature range of 4K to 400°F. EP21TCHT-1 is NASA low outgassing certified and is therefore highly recommended for use in vacuum environments.