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Featuring high thermally conductive fillers, Master Bond EP48TC is a two component epoxy paste that can be applied in bond lines as thin as 10-15 microns. This material offers exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W, which imparts impressive heat transfer capabilities and thermal conductivity of 20-25 BTU•in/ft2•hr•°F [2.88-3.60 W/(m•K)]. It complies with NASA low outgassing specifications and can be used in applications in a variety of high-tech industries.
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FLM36
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Master Bond FLM36 is a film adhesive featuring excellent thermal conductivity and electrical insulation properties. FLM36 retains its high strength at temperatures up to 500°F, while offering enhanced resistance to thermal cycling and thermal/mechanical shock. It differs from other heat resistant epoxies due to its toughness and its ability to provide uniform bond line thicknesses.
For more information, request a data sheet on FLM36 |
| Supreme 3AOHT
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Supreme 3AOHT is a one component thermally conductive, electrically isolating epoxy that is especially well suited for high speed production operations. This toughened epoxy features superior strength properties after exceptionally fast cures in as little as 5-10 minutes at 300°F or 20-30 minutes at 250°F. It bonds well to similar and dissimilar substrates including glass, metals, ceramics and most plastics. These bonds are maintained even after exposure to severe thermal cycling, mechanical shocks and vibration.
For more information, request a data sheet on Supreme 3AOHT |
| EP21TDC-2AN |
EP21TDC-2AN has been specially designed for use in applications requiring resistance to thermal cycling, vibration, impact and shock. It offers a thermal conductivity of 22-24 BTU•in/ft2•hr•°F [3.17-3.46 W/(m•K)] and is an excellent electrical insulator. The cured compound exhibits a high elongation—greater than 25%, which is truly exceptional for a thermally conductive epoxy. It has a service temperature range of 4K to 250°F and has been successfully employed in a number of cryogenic applications.
For more information, request a data sheet on EP21TDC-2AN |
| MasterSil 156 |
Featuring superb electrical insulation properties, MasterSil 156 is a two component, low viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU•in/ft²•hr•°F [1.15 W/(m•K)]. This system also passes UL 94V-0 testing for flame retardancy.
For more information, request a data sheet on MasterSil 156 |
| EP46HT-1AO |
With exceptional thermal conductivity and electrical insulation properties, EP46HT-1AO is a two component epoxy for high performance bonding and sealing applications. This high temperature resistant system has a glass transition temperature exceeding 215°C. It cures readily with heat and offers a long open time at room temperatures. EP46HT-1AO provides noteworthy dimensional stability, chemical resistance and superior physical strength properties.
For more information, request a data sheet on EP46HT-1AO |
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Copyright  2015 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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May 2015
