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Behind the Bonds: 40 Years of Adhesive Manufacturing |
Forty years since our founding, we decided to take a stroll down memory lane and reminisce how Master Bond got its start. Join Dr. B as we learn about the first orders and products that helped us grow into a leading high tech adhesives manufacturer.
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Two Component, Room Temperature Curing Epoxy |
With outstanding physical properties and durability, EP21 is a moderate viscosity epoxy formulated for bonding, sealing, coating and encapsulation applications. It has a very forgiving one to one mix ratio by weight or volume which can be adjusted to deliver enhanced impact resistance or machinability. This system bonds well to a variety of substrates including metals, composites, glass, ceramics and many rubbers and plastics. EP21 withstands thermal cycling and offers sterling electrical insulation properties.
For more information, request a technical data sheet on EP21
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| Low Viscosity System Is Ideal for Potting and Encapsulation |
EP21LV is a low viscosity epoxy for high performance bonding, sealing, coating, encapsulation and casting. Mixed viscosity is 10,000-13,000 cps. Shore D hardness is greater than 70. This two part system produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals. EP21LV meets FDA Chapter 1, Section 175.105 requirements for indirect food contact.
For more information, request a technical data sheet on EP21LV
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Flame Resistant Epoxy System for Industrial Applications |
Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60°F to 200°F. It is remarkably resistant to thermal cycling and many chemicals. EP21FRNS-2 is exceptionally durable and tough. It also features a convenient one to one mix ratio by weight.
For more information, request a technical data sheet on EP21FRNS-2
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| Thermally Conductive Epoxy Passes ASTM E595 Requirements |
Combining impressive thermal conductivity of 9-10 BTU•in/ft2•hr•°F with superb electrical insulation properties, EP21AOLV-2LO is ideal for potting, bonding, sealing and coating applications. In fact, it can be used in larger potting applications because it has low exotherm when curing. This NASA low outgassing certified system has a low coefficient of thermal expansion, enhanced dimensional stability, a high tensile modulus and first rate compressive strength properties.
For more information, request a technical data sheet on EP21AOLV-2LO
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| Two Part, Silver Filled Epoxy Adhesive Has Low Volume Resistivity |
Electrically conductive EP21TDCSFL features high bond strength and outstanding resistance to thermal cycling. Its high flexibility and low shrinkage produce very little stress on sensitive components and substrates. This easy to handle system can be easily applied, has superb flow properties and cures at ambient temperatures. Serviceable from 4K to +250°F, EP21TDCSFL can function even in cryogenic conditions.
For more information, request a technical data sheet on EP21TDCSFL
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| Radiopaque Epoxy Offers Easy Handling |
EP21BAS is a two component radiopaque epoxy that is often used for medical diagnostic devices to achieve optical visibility when exposed to x-rays, fluoroscopes or x-ray imaging procedures. It has been formulated to be effective for even 100KV, px-ray (peak x-ray) machines and higher energy capacities. This system cures readily at ambient temperatures and more quickly at elevated temperatures with a convenient one-to-one mix ratio, by weight or volume. EP21BAS produces high strength, durable bonds, seals, coatings and castings which hold up well to thermal cycling and resist many chemicals including water, oils, fuels, acids, bases and salts.
For more information, request a technical data sheet on EP21BAS
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Copyright  2016 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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January 2016
