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EP21AOLV-2LO: NASA Low Outgassing, Thermally Conductive Epoxy
EP21AOLV-2LO combines outstanding thermal conductivity of over 10 BTU•in/ft2•hr•°F with excellent electrical insulation properties for potting, bonding, sealing and coating applications. In fact, it can be used in larger potting applications because it has very low exotherm when curing. This NASA low outgassing system has a low coefficient of thermal expansion and enhanced dimensional stability, along with both a high modulus and compressive strength.
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For more information,
request a technical data sheet on EP21AOLV-2LO |
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EP30: Low Viscosity, Optically Clear Two Part System
Featuring superior strength characteristics, Master Bond EP30 bonds well to a variety of substrates including metal, glass, ceramics, many plastics and rubber materials. This highly dimensionally stable system has very low shrinkage after cure, less than 0.003 in./in. Its low viscosity enables this system to be used for adhering surfaces with tight clearances.
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For more information, request a technical data sheet on EP30 |
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EP37-3FLFAO: Resists Rigorous Vibration, Impact and Thermal Cycling
Cryogenically serviceable down to 4K, EP37-3FLFAO is well suited for demanding potting, bonding, sealing and coating applications. It has an unusual blend of properties including high thermal conductivity, excellent electrical insulation properties, good physical strength and a high degree of flexibility. EP37-3FLFAO has also been certified by NASA as a low outgassing epoxy.
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For more information, request a technical data sheet on EP37-3FLFAO |
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EP21TPND: Exceptional Resistance to Fuels and Oils
Unlike many chemical resistant epoxy based materials, EP21TPND has excellent toughness and flexibility enabling it to resist rigorous thermal cycling as well as mechanical and thermal shocks. It can withstand exposure to a number of chemicals including water, gasoline, fuels, oils, hydrocarbons, hydraulic fluids and many acids and bases. This epoxy polysulfide has a non-drip consistency and is widely used in the aerospace, OEM, electronic, electrical, chemical and related industries.
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For more information, request a technical data sheet on EP21TPND |
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UV15DC80: One Component Dual Cure Formulation
Addressing “shadowing” issues, UV15DC80 is a dual cure epoxy based system that cures upon exposure to UV light and with heat. The heat portion of the cure schedule can be initiated at only 80°C rather than at the more common 125°C. It is not oxygen inhibited and has outstanding chemical resistance to many acids, bases, fuels and solvents. This unique adhesive is a superb electrical insulator and bonds well to metals, glass, ceramics and most plastics.
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For more information, request a technical data sheet on UV15DC80 |
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MasterSil 801: Serviceable Up To +300°C
Thermally stable, MasterSil 801 is a high performance, one part silicone for bonding, sealing, coating and formed-in-place gaskets. It is extremely soft with superb flexibility and elasticity that provides top notch electrical insulation properties. This specialty system features a non-corrosive cure, making it highly desirable for many applications, especially those pertaining to electronics and aerospace.
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For more information, request a technical data sheet on MasterSil 801 |
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Copyright © 2013 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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