|
EP36CLV: Heat Resistant, Flexible B-Staged Epoxy Resin Composition |
|
|
Master Bond EP36CLV is a one component, high temperature resistant, B-staged epoxy that cures with excellent toughness and is far less rigid than typical high temperature resistant epoxies. EP36CLV is available in 30 gram cookies that need to be heated to 150-180°F in order to transform to a liquid. This electrically insulative system is serviceable for temperatures up to 500°F and is used primarily for potting and encapsulation applications.
For more information, request a technical data sheet on EP36CLV
|
|
Supreme 3HTND-2CCM: Toughened, One Part Epoxy for Electrical Applications |
|
|
Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound dimensional stability. Its inherent toughness allows it to withstand the most intense types of thermal cycling. This fast curing system has a paste consistency that flows slightly while curing. Supreme 3HTND-2CCM passes NASA low outgassing test requirements which allow it to be used in vacuum, aerospace and clean room applications.
For more information, request a data sheet on Supreme 3HTND-2CCM
|
|
|
MasterSil 705TC: Single Component Heat Dissipative Silicone Compound |
|
|
One component MasterSil 705TC is a thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It is well suited for applications that require flexibility and high temperature resistance up to +400°F. It cures readily at ambient temperatures when exposed to atmospheric moisture and is a non-corrosive paste. MasterSil 705TC is also ideal for a variety of applications where a degree of reworkability is desired.
For more information, request a data sheet on MasterSil 705TC
|
|
|
UV15-7LRI: Low Viscosity, Optically Clear UV System is Dimensionally Stable |
|
|
UV15-7LRI is a solvent free, optically clear, electrically insulative compound with excellent light transmission properties. It has a low refractive index of 1.481. Well suited for a variety of bonding, sealing, coating and encapsulation applications, it is a rigid, high strength UV curable compound. This one part system can be cured quickly in sections up to 1/8 inch thick upon exposure to an appropriate UV light source. UV15-7LRI is not oxygen inhibited and does not require any special treatment.
For more information, request a data sheet on UV15-7LRI
|
|
|
EP21TDC-2: Flexible Epoxy Compound Offers High Peel Strength |
|
|
Featuring very low exotherm, Master Bond EP21TDC-2 is a two component epoxy paste adhesive formulated to cure fully at ambient temperatures. It has outstanding chemical resistance and thermal cycling properties while still maintaining functionality at cryogenic temperatures. EP21TDC-2 is also resistant to thermal shock and vibration. Elongation after cure is >120%.
For more information, request a data sheet on EP21TDC-2
|
|
 newsletters@masterbond.com
 +1 201 343 8983
Copyright  2016 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
|
|
|
|
View this email online
April 2016
