Master Bond Supreme 45HTQ is a two component, quartz filled compound for high performance structural bonding, casting and sealing. This toughened epoxy produces high strength bonds at both ambient and elevated temperatures while maintaining exceptional resistance to thermal cycling and many harsh chemicals. It is suitable for applications where long-term exposure to temperatures from -60°F to +450°F is required.

Featuring an attractive balance of high physical strength and dimensional stability, EP30AO is well suited for a variety of electronic applications where heat dissipation is needed. In particular, its low viscosity and superior flow properties make it an ideal potting compound. This epoxy forms rigid bonds that are resistant to water and many chemicals including oil and most solvents.

Thermally stable, MasterSil 801 is a high performance, one part silicone for bonding, sealing, coating and formed-in-place gaskets. It is extremely soft with superb flexibility and elasticity that provides top notch electrical insulation properties. This specialty system features a non-corrosive cure, making it highly desirable for many applications, especially those pertaining to electronics and aerospace.

Master Bond EP21TDCHT is a flexibilized epoxy adhesive that has been specifically designed to bond substrates with different coefficients of expansion and contraction. It is simple to use with a one to one mix ratio and is easy to apply. EP21TDCHT offers exceptionally high peel and tensile lap shear strength.

Designed for bonding, coating, sealing and encapsulating, Master Bond EP21FL has a low viscosity and cures at room temperature. It is a toughened system that is ideal for bonding dissimilar substrates with differing coefficients of expansion. EP21FL is effective for bonding surfaces subjected to rigorous thermal cycling as well as thermal and mechanical shocks.

Master Bond’s Supreme 10AOHT-LO features high peel and shear strengths, superior electrical insulation properties and a thermal conductivity of 9-10 BTU/in/ft²/hr/°F. It has a service temperature range of 4K to +400°F. This one part system is resistant to impact, thermal shock, vibration and stress fatigue cracking while meeting NASA low outgassing requirements. It is used in applications ranging from optoelectronic assemblies to satellite assembly and repair.