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EP29LPAO is a two component thermally conductive, electrically insulative epoxy well suited for potting and encapsulating, even in large volumes. This video explains proper handling and mixing techniques for this product as well as demonstrates various casting applications, highlighting its low exotherm, long working life of 7-9 hours at room temperature for a 100 gram mass and its ambient/low temperature curing characteristics.
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Additionally EP29LPAO offers an outstanding high strength profile, with a tensile modulus of 450,000-500,000 psi and a compressive strength of 24,000-26,000 psi at 75°F. Adhesion to a wide range of substrates such as metals, glass, ceramics and many plastics is excellent. EP29LPAO is often used in the aerospace, electronic, electrical and specialty OEM industries.
Some additional properties include:
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Service temperature range
-60°F to +250°F [-51°C to +121°C] |
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Thermal conductivity
9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)] |
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Volume resistivity
greater than 1015 ohm-cm
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Tensile strength
3,000-4,000 psi |
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| Two Part Epoxy with Very Low Exotherm |
EP21LVSP6 is a two component system that is also well suited for potting and encapsulation applications. It offers a very convenient one to one mix ratio, by weight or volume and is formulated to cure at room temperature. It has a desirable combination of a long open time of 3-5 hours, low mixed viscosity of 4,000-6,000 cps and excellent electrical insulation properties. Additionally it features a very low exotherm and can be used for casting deep cross-section thicknesses. EP21LVSP6 has superior physical strength and chemical/water resistant characteristics.
For more information, request a technical data sheet on EP21LVSP6
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Optically Clear, Water Resistant Silicone Compound |
For potting applications where low exotherm and high flexibility are required, MasterSil 151 is an ideal candidate. Featuring outstanding electrical insulation properties and a low viscosity, MasterSil 151 also provides superior resistance to vibration and shock. This high strength compound has an elongation of 120-150% and very low shrinkage upon cure. Serviceable over the wide temperature range of -65°F to +400°F, MasterSil 151 offers convenient handling with the ability to cure at room temperature or faster at elevated temperatures. Specialty uses include encapsulating LEDs, optical fiber cladding and potting connectors.
For more information, request a technical data sheet on MasterSil 151
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Copyright  2016 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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June 2016
