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Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. This epoxy will bond well to a wide variety of substrates, including metals, composites, ceramics, glass and many plastics. It is also noteworthy for its low linear ( <0.01%) and volumetric ( <0.1%) shrinkage. It has a forgiving, non-critical mix ratio and after mixing, the consistency is that of a paste with some flow.
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EP21TDCANHT
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As a flexibilized system, EP21TDCANHT is well suited for bonding dissimilar substrates over the wide service temperature range of -100°F to 400°F. It has exceptionally high thermal conductivity and withstands severe thermal cycling. This dimensionally stable system also offers a robust tensile lap shear and peel strength profile.
For more information, request a data sheet on EP21TDCANHT |
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EP21SC-1 |
Featuring an array of high performance properties, Master Bond EP21SC-1 is ideal for chemical and mechanical processing applications as well as tank and chute maintenance. This exceptionally rigid material has a hardness exceeding 95 Shore D and offers impressive dimensional stability. EP21SC-1 includes a silicon carbide filler which enhances its abrasion resistance. It also withstands a wide variety of chemicals including water, acids, bases, hydraulic fluids and oils.
For more information, request a data sheet on EP21SC-1 |
| UV22 |
With superb optical clarity and abrasion resistance, UV22 will cure quickly and easily when exposed to a UV light source. Cationic cure systems, such as UV22, tend to have much higher temperature resistance than other UV type systems. Its glass transition temperature (Tg) with a straight UV cure is 100°C, and when post cured for 30 minutes at 125-150°C, the Tg is 135°C. It also has exemplary low shrinkage properties, linearly less than 1%. UV22 is nanosilica filled and offers superior adhesion to glass, ceramics, metals and most plastics.
For more information, request a data sheet on UV22 |
| EP77M-F |
Master Bond EP77M-F delivers a very low volume resistivity of <0.001 ohm-cm. Unlike the majority of two part, silver conductive epoxy systems, EP77M-F has a convenient, one to one mix ratio, by weight or volume. This smooth paste will set up at ambient temperatures within 5-7 minutes even when mixed in very small amounts. Full cures usually take about 8-12 hours at room temperature.
For more information, request a data sheet on EP77M-F |
| EP42HT-2AO-1 Black |
EP42HT-2AO-1 Black features outstanding temperature and chemical resistance and is widely used in a variety applications where thermal conductivity is needed. This cryogenically serviceable system also meets NASA low outgassing requirements. Aside from being a superior adhesive, sealant and coating, EP42HT-2AO-1 Black is castable to thicknesses exceeding 2-3 inches.
For more information, request a data sheet on EP42HT-2AO-1 Black |
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Copyright  2015 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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February 2015
