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Low viscosity, EP62-1LPSP is a two component epoxy that features an exceptionally long working life of 12-24 hours at ambient temperatures. Its thin consistency, long open time and low exotherm allows this system to be used for moderate and larger sized electrical encapsulations. This optically clear system has outstanding thermal stability with a service temperature range extending from -60°F to +400°F.
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EP3RRLV
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One part epoxy system, EP3RRLV is formulated for high performance potting, encapsulation and underfill applications. This low viscosity adhesive withstands heat and thermal cycling. It also is resistant to mechanical vibration and shock. EP3RRLV is widely used in microelectronic assembly and packaging applications where excellent electrical insulation and fast cure times are essential.
For more information, request a data sheet on EP3RRLV |
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EP30AO |
Master Bond EP30AO is a thermally conductive, electrically insulative potting and encapsulation compound that facilitates thermal management by permitting effective heat dissipation from highly populated circuit boards. EP30AO has a low viscosity, cures at room temperatures, has superior dimensional stability and high physical strength properties. It also resists thermal cycling and long-term exposure to chemicals, including water, oils and fuels.
For more information, request a data sheet on EP30AO |
| MasterSil 156 |
Featuring superb electrical insulation properties, MasterSil 156 is a two component, low viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU•in/ft²•hr•°F (1.15 W/(m•K)). This silicone also passes UL 94V-0 testing for flame retardancy.
For more information, request a data sheet on MasterSil 156 |
| EP21FL |
Designed for bonding, coating, sealing and encapsulating, EP21FL has a low viscosity and cures at room temperature. It is a toughened system that is ideal for bonding dissimilar substrates with differing coefficients of expansion. EP21FL is effective for bonding surfaces subjected to rigorous thermal cycling and mechanical shocks.
For more information, request a data sheet on EP21FL |
| EP21AR |
High performance epoxy adhesive, EP21AR, has successfully withstood immersion in 96-98% sulfuric acid and 36% hydrochloric acid for over a year. It features excellent resistance to fuels, oils, ethanol and many organic solvents. EP21AR has been employed for use as a coating/liner for chemical and fuel storage tanks, chemical piping, scrubbers and chemical processing equipment. This epoxy system has a convenient one to one mix ratio, cures at room temperatures and is easy to apply.
For more information, request a data sheet on EP21AR |
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Copyright  2015 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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View this email online
January 2015
