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Meeting the UL 94V-0 requirements for flame retardancy, MasterSil 156 is a two component silicone system for potting and encapsulation applications. Additionally, it combines high temperature resistance, flexibility and thermal conductivity of more than 1.15 W/(m•K).
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Products With Excellent Heat Dissipation Properties
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Thermally conductive one part epoxy, Supreme 10AOHT-LO offers an excellent balance of performance properties including both high shear and peel strength. It is cryogenically serviceable and meets NASA low outgassing requirements. Learn more
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B-staged epoxy, EP36AO, features outstanding thermal shock resistance and exceptional thermal conductivity over the wide temperature range of -80°F to +500°F. It is available for use in 30 gram cookies. Learn more
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Certified to meet NASA low outgassing requirements, EP30AN-1 offers room temperature cures and excellent electrical insulation properties for high performance potting, sealing, coating and bonding applications. This low viscosity system has a low coefficient of thermal expansion. Learn more
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Well suited for applications where heat dissipation is critical, MasterSil 151AO delivers high temperature resistance, elongation of more than 120% and very good thermal conductivity. This two component silicone compound can cure up to 1-2 inches. Learn more
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EP21TCHT-1 is a two component, thermally conductive, heat resistant epoxy formulated to cure at ambient temperatures. This NASA low outgassing approved epoxy develops a tensile lap shear strength of 1,800 psi. It withstands exposure to rapid thermal cycling. Learn more
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Inside Our Lab
Master Bond's thermally conductive adhesives offer superior heat dissipation for a wide range of electronic applications. Both one and two component systems are available for use. They include epoxies, silicones and elastomeric products. Special formulations designed for demanding service conditions are also available.
Learn more about the benefits of Master Bond epoxies with thermal conductivity.
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154 Hobart Street, Hackensack, New Jersey, USA
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Copyright © 2013 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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