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This video demonstrates the ease of use and impressive properties of Master Bond Supreme 18TC, a one component smooth epoxy paste adhesive. Formulated with a blend of special thermally conductive fillers, this system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 BTU•in/ft2•hr•°F [3.17-3.61 W/(m•K)]. It can be used in a variety of high tech industries, including aerospace, electronic, optical, cryogenic and specialty OEM.
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Additional properties include: |
NASA low outgassing
Passes ASTM E595 testing |
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Wide service temperature range
4K to +400°F |
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Tensile lap shear strength
2,200-2,400 psi
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Fast cure schedules
60-90 minutes at 250-300°F |
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Electrical insulation properties
Volume resistivity greater than 1014 ohm-cm |
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Convenient handling
“Unlimited” working life at room temperature
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EP48TC: Thermally Conductive Epoxy for Heat Sensitive Substrates |
For applications involving heat sensitive substrates, Master Bond offers EP48TC, a two component adhesive that features the same heat transfer capabilities as Supreme 18TC, as well as the ability to be cured in thin bond lines. This compound has an optimum cure schedule of overnight at room temperature, followed by 3-5 hours at 150-200°F. EP48TC also features minimal shrinkage upon curing, a low coefficient of thermal expansion and a Shore D hardness of 85-95.
For more information, request a technical data sheet on EP48TC
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Copyright 2016 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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