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Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity and electrical insulation values, this system offers superior protection to electronic components. Serviceable over the wide temperature range of -100°F to +400°F, it resists chemicals rather well, including water, acids, bases and many solvents. Especially noteworthy is its low level of ionic impurities. Supreme 3HTND-2GT cures in 20-30 minutes at 250°F or in 5-10 minutes at 300°F with very low shrinkage. It can also cure in thicknesses of up to 1/8 inch if needed.
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Adhesives/Potting Compounds with Excellent Electrical Properties
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EP3RRLV is a unique low viscosity formulation for potting/underfill applications. It offers high mechanical strength properties, outstanding dimensional stability, superior thermal conductivity and sterling electrical insulation properties. Learn more
With an extraordinarily fast non-corrosive cure, MasterSil 711 is extremely soft with superb flexibility for bonding, sealing, coating and formed-in-place gaskets applications. This one part system is self leveling. Learn more
UV curable UV15-7TK1A exhibits an exceptional combination of properties including outstanding durability, good electrical insulation, along with noteworthy thermal cycling capabilities.Learn more
Cryogenically serviceable EP30D-10 is a two component, urethane modified epoxy with superior abrasion resistance and toughness to withstand harsh environmental conditions. Learn more

Inside Our Lab

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Glob top encapsulations are often preferred for their ability to protect chips without damaging fragile wires. They are formulated to exhibit specific physical properties such as electrical insulation, resistance to moisture and chemicals and thermal conductivity, to name a few. These encapsulants play a critical role in successfully manufacturing many common consumer and industrial devices. Learn more by downloading our white paper on Protecting Chip on Board (COB) Devices with Glob Top Encapsulants
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