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MB600S, MB600SCN and MB600G make up our line of aqueous based, sodium silicate coatings that provide impressive shielding effectiveness for EMI/RFI applications. This helpful infographic compares these highly effective systems.
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Fast Setting, One Component, Electrically Conductive Silicone
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Often selected for applications requiring static dissipation or EMI/RFI shielding, MasterSil 705C has superior electrical conductivity and is used in applications where a non-metallic system is required. This carbon filled, one component product is non-corrosive and retains typical silicone type flexibility and high temperature resistance.
For more information, request a technical data sheet on MasterSil 705C
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Quick Curing Epoxy Offers Superior Chemical Resistance
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Master Bond EP3RRLV is a one part epoxy system formulated for high performance potting, encapsulation and underfill applications. This low viscosity adhesive withstands heat and thermal cycling. It also is resistant to mechanical vibration and shock. EP3RRLV is widely used for microelectronic assembly and packaging applications where excellent electrical insulation and fast cure times are required.
For more information, request a technical data sheet on EP3RRLV |
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Flexible Epoxy Offers High Thermal Conductivity
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Master Bond EP21TDC-2AN has been specially designed for use in applications requiring resistance to thermal cycling, vibration, impact and shock. It offers a thermal conductivity of 18 BTU•in/(h•ft2•°F) and is an excellent electrical insulator. The cured compound exhibits a high elongation—greater than 25%, which is truly exceptional for a thermally conductive epoxy. It has a service temperature range of 4K to 250°F and has been successfully employed in a number of cryogenic applications.
For more information, request a technical data sheet on EP21TDC-2AN |
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Exceptionally High Glass Transition Temperature |
UV10TK40 features temperature resistance up to 450°F and a glass transition temperature of 140°C. This one part, high viscosity UV system also offers excellent dimensional stability. Optically clear, UV10TK40 can cure in sections up to 0.090-0.100 inches when exposed to a UV light source.
For more information, request a technical data sheet on UV10TK40 |
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One Part Epoxy for Surface Mount Applications |
Supreme 3HTND-1SM is a rapid curing, no-mix, thixotropic, surface mount adhesive for high performance bonding applications. It features exceptional toughness, durability, no stringing and a consistent dot profile. Additionally, this epoxy has excellent electrical insulation properties, good thermal conductivity and an enhanced ability to withstand thermal cycling and mechanical shocks.
For more information, request a technical data sheet on Supreme 3HTND-1SM |
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Adhesives, Sealants & Coatings for the Electronic Industry |
This 32-page catalog offers performance properties on Master Bond’s extensive line of epoxy, silicone, polyurethane, silicate based and light curing compounds. These products provide solutions to PCB assembly, die-attach, conformal coating, surface mount, lid sealing, chip and wire bonding applications.
Request a copy of the catalog |
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Copyright  2014 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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October 2014
