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Conductive Coatings for EMI/RFI Shielding Applications
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Prevent malfunctions of electronic devices with conductive coatings for EMI/RFI shielding applications developed by Master Bond. From epoxy adhesives and sealants to silicones and sodium silicates, we have a wide range of formulations to meet the ever changing needs of devices requiring EMI/RFI shielding.
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MB600S
Master Bond MB600S is an aqueous based sodium silicate coating formulated for applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required. Tested according to IEEE 299, 2006 methods, MB600S was as effective as the aluminum reference with a shielding effectiveness of 95-105 dB, from 100 MHz to 2 GHz. It is easy to brush on and being water based, the system is relatively non-toxic.
Request a technical data sheet on MB600S
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MasterSil 705S
Silver filled MasterSil 705S is a single component silicone that cures at room temperature for bonding, sealing and EMI/RFI shielding applications. This easy to use compound is non-corrosive and has a very low volume resistivity of less than 0.01 ohm-cm. It combines both high flexibility and high temperature resistance with a service operating temperature range of -60°F to +400°F. It has especially good adhesion to other silicones permitting wide applicability for use with most gasketing materials.
Request a technical data sheet on MasterSil 705S
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EP75-1
Master Bond EP75-1 is a graphite filled epoxy adhesive/sealant. Its superior electrical conductivity makes it particularly well suited for shielding and static dissipation applications where a non-metallic filler is required. This durable, two part epoxy resists harsh chemicals, bonds to dissimilar substrates and performs well from -60°F to 250°F.
Request a technical data sheet on EP75-1
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MasterSil 155
MasterSil 155 cures to a tough, flexible and electrically conductive black rubber. This graphite filled, two component silicone is formulated to have a smooth paste consistency which assures complete fill-in around complicated contours in a variety of bonding and sealing applications. It is widely used for bonding and/or sealing of electronic components, electrical devices and various electro-optical systems as well as for special electronic circuitry. This product offers superior protection against adverse environmental conditions in bonding and gasketing applications.
Request a technical data sheet on MasterSil 155
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EP21TDCNFL
With its convenient one to one mix ratio, EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing. It readily develops a high bonding strength of more than 1,500 psi tensile lap shear and a T-peel of greater than 30 pli. As a sealant it resists many chemicals over the exceptionally wide temperature range of 4K to +250°F enabling it to be serviceable in cryogenic applications. Its exceptional flexibility makes EP21TDCNFL particularly useful in bonding dissimilar substrates that are being thermally cycled and shocked.
Request a technical data sheet on EP21TDCNFL
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154 Hobart Street, Hackensack, New Jersey, USA
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Copyright © 2013 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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