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Serviceable up to 400°F, Supreme 11AOHT-LO features exceptional thermal conductivity and electrical insulation properties for high performance bonding and sealing applications. This two part system delivers impressive toughness which enables it to withstand rigorous thermal cycling and makes it particularly well suited for bonding dissimilar substrates. Formulated to cure at ambient temperatures this epoxy compound has a convenient one to one mix ratio and meets NASA low outgassing specifications.
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Highly Flexibilized, Thermally Conductive Epoxy
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Two component, cryogenically serviceable EP21TDC-2AO offers an impressive elongation of over 25% for high performance bonding sealing, coating and encapsulation. This room temperature curing system exhibits superb tensile lap shear and T-peel strength while maintaining superior chemical resistance. Most noteworthy is its ability to withstand thermal cycling and mechanical shock.
For more information, request a data sheet on EP21TDC-2AO |
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Two Component Silicone with Good Flow Properties
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Featuring exceptional thermal conductivity of 22-24 BTU•in/ft2•hr•°F, MasterSil 151AN is a high performance potting and encapsulation compound for applications involving sensitive optical and electronic components. This electrical insulator has good flow properties and is serviceable over the wide temperature range of -65°F to +400°F. As an addition cured silicone, MasterSil 151AN doesn’t require exposure to air for cross-linking. It is 100% solids, contains no solvents or diluents and will not outgas while curing.
For more information, request a data sheet on MasterSil 151AN |
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Thermally Conductive, Electrically Insulative Epoxy
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EP112FLAO-1 is a flexibilized epoxy designed for high performance electrical and electronic applications where good thermal conductivity and electrical isolation is required. This low viscosity, two part system has a long working life and cures readily at elevated temperatures to a tough strong solid with heat resistance up to 450°F. It also offers high dimensional stability, thermal shock/vibration resistance and excellent adhesion to a wide variety of substrates.
For more information, request a data sheet on EP112FLAO-1 |
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NASA Low Outgassing Certified Two Part Epoxy
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With a convenient one to one mix ratio by weight, low viscosity EP21LV-LO bonds well to metals, glass, ceramics and many types of rubbers and plastics. This high strength system also resists many chemicals, including water, oils, fuels, acids, bases and salts. EP21LV-LO features outstanding physical strength properties, along with being an excellent electrical insulator. This combination of properties enables it to be readily used as a potting and encapsulation compound.
For more information, request a data sheet on EP21LV-LO |
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B-Staged Film Meets NASA Low Outgassing Requirements
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Master Bond FLM36-LO is a film adhesive featuring excellent thermal conductivity and electrical insulation properties. As a film, it is very easy to handle, offers uniform bond line thickness and limited squeeze out when curing. FLM36-LO retains high physical strength properties at temperatures up to 500°F, while combining enhanced thermal/mechanical shock resistance and thermal cycling capabilities. It differs from other heat resistant epoxies due to its toughness.
For more information, request a data sheet on FLM36-LO |
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Copyright  2014 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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September 2014
