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Master Bond EP21TCHT-1 is a heat resistant polymer system formulated for high performance bonding and sealing applications. It features high thermal conductivity and superior electrical insulation properties with a service temperature range of 4K to 400°F. This epoxy can withstand rigorous thermal cycling and shocks. Its thermal expansion coefficient is remarkably low. EP21TCHT-1 is NASA low outgassing certified and is therefore highly recommended for use in vacuum environments.
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Thermally Conductive, Electrically Insulating Epoxy
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This two part, room temperature curing epoxy combines a variety of high performance properties for bonding and sealing applications. First and foremost, Supreme 11AOHT delivers outstanding thermal conductivity and electrical isolation. It also produces bonds with exceptionally high shear and peel strengths of 1,600 psi and 15 pli at 75°F, respectively. This toughened system is able to withstand rigorous thermal cycling over the wide service temperature range of -100°F to +400°F.
For more information, request a data sheet on Supreme 11AOHT
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High Viscosity UV System Passes NASA Low Outgassing Tests |
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Master Bond UV10TKLO-2 is a special one component UV curable epoxy modified system for high performance bonding, sealing and encapsulation. This system can be cured in thicker sections, up to 1/16 of an inch and can be easily “layered” to higher levels. Most significantly, its low outgassing properties enable this UV compound to be used in a wide array of optical, electro-optical and vacuum applications that until now have been “off limits” for UV curable epoxies.
For more information, request a data sheet on UV10TKLO-2
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Silicone Offers Protection for Delicate Electronic Components
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Master Bond MasterSil 800 is an adhesive and sealant that provides unsurpassed thermal stability at temperatures as high as 300°C. MasterSil 800 is a ready to use, one part, high performance, non-corrosive silicone elastomer compound. It is low in viscosity making it free flowing and self leveling so it is ideal for bonding, sealing, protective coatings, encapsulating and creating formed-in-place gaskets.
For more information, request a data sheet on MasterSil 800
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NASA Low Outgassing Epoxy Has Superior Heat Dissipation
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Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100°F to +500°F with a glass transition temperature exceeding 200°C. This dimensionally stable system bonds well to a wide variety of substrates including metals, glass, ceramics, composites, various rubbers and many plastics.
For more information, request a data sheet on EP46HT-2AO Black
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One Part, Toughened Epoxy Adhesive, Sealant, Coating
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Well suited for glob top applications, versatile Supreme 3HTND-2GT can also be used for a variety of precise positioning and bonding applications in the microelectronic and electronic industries. This toughened epoxy offers remarkable protection against adverse environmental conditions, vibration, impact and thermal shock for components on circuit boards. It is easy to handle, cures rapidly at elevated temperatures, has low shrinkage and exceptional electrical insulation characteristics.
For more information, request a data sheet on Supreme 3HTND-2GT
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Adhesives, Sealants & Coatings for the Aerospace Industry
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This new 28 page catalog features a variety of products that are widely used for structural bonding, sealing and gap filling. These formulations ensure reliability in the assembly of aircraft structures, components, interiors and MRO applications. Our conformal coatings and potting/encapsulation compounds protect sensitive electronic parts against extreme conditions. Many of them meet rigorous industrial certifications including NASA low outgassing requirements.
Request a copy of our aerospace catalog
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 newsletters@masterbond.com
 +1 201 343 8983
Copyright  2014 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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View this email online
August 2014
