|
|
| New White Paper: Achieving Better Adhesion with Proper Surface Preparation |
Achieving good adhesion not only depends on selecting the right adhesive, but also on implementing the best surface preparation techniques. Regardless of the substrate, proper surface preparation always plays an essential role in achieving strong bonds. This white paper explores the various techniques including degreasing, abrasion, chemical treatments and physical methods.
|
|
|
|
Thermally Conductive, Electrically Isolating Epoxy Resists High Temperatures |
Supreme 11AOHT is a two part, room temperature curing, toughened epoxy system for bonding and sealing applications. It produces bonds with exceptionally high shear and peel strengths of 1,600 psi and 15 pli at 75°F, respectively. This compound is able to withstand rigorous thermal cycling over the wide service temperature range of -100°F to +400°F. It has a thixotropic paste viscosity.
For more information, request a technical data sheet on Supreme 11AOHT |
|
|
| Electrically Insulative Single Component Epoxy |
Offering rigid and dimensionally stable bonds, Master Bond EP13 is the ideal epoxy for high performance structural bonding applications. This durable, one component epoxy features both high tensile shear and compressive strength. EP13 is also resistant to high temperatures, most harsh chemicals and it easily machinable properties.
For more information, request a technical data sheet on EP13 |
|
|
| Adhesive System Sets Up In Just 3 minutes At Room Temperature |
Master Bond EP51M epoxy system is fast curing making it ideal for high speed production line assembly bonding operations. It produces durable and strong bonds that are resistant to thermal cycling and a variety of chemicals. Serviceable from 4K to 250°F, EP51M bonds well to dissimilar substrates. With a convenient one to one mix ratio, it is also easy to use.
For more information, request a technical data sheet on EP51M |
|
|
| Epoxy System Features High Glass Transition Temperature |
Master Bond EP46HT-2 is a two part epoxy formulated for bonding, sealing and casting applications where resistance to temperatures from -100°F to +550°F is required. This oven curing system features an extremely high glass transition temperature, exceeding 220°C. When cured, EP46HT-2 features exceptional physical and mechanical properties while exhibiting superior chemical resistance. It also withstands thermal cycling.
For more information, request a technical data sheet on EP46HT-2 |
|
|
| Flowable, No-Mix LED Curable Polymer System |
Featuring breakthrough LED technology, LED401LV will cure completely tack-free when exposed to a light source emitting 405 nm wavelength in sections of 1/8 inch thick and beyond. Once cured, it has impressive physical properties, including outstanding dimensional stability, very good electrical insulation and commendable chemical resistance. Since LED light sources do not generate as much heat as UV ones, LED401LV can be used with heat sensitive substrates.
For more information, request a technical data sheet on LED401LV |
|
|
| Rapid Curing, Silver Filled Epoxy Compound |
Well suited for demanding manufacturing applications, EP3HTS is a one part, electrically conductive epoxy system featuring low volume resistivity of <0.001 ohm-cm. Cures can be obtained in 40-90 minutes at 250°F or 20-40 minutes at 300°F. Tensile shear strengths over 1,000 psi are obtained using these fast cure times. This system has a service temperature range of -60°F to +400°F. EP3HTS is easy to dispense.
For more information, request a technical data sheet on EP3HTS |
|
|
|
Copyright  2015 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
|
|
View this email online
January 2015
