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July 2014
New White Paper: One Component Epoxies: Versatility and Convenience
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In this white paper, we explore how a one part system is constructed, how it can and should be used, and how it can be modified to achieve a variety of performance properties. Also learn how technological advances have resulted in innovative, unique systems.

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Electrically Insulative, High Performance Epoxy
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Offering rigid and dimensionally stable bonds, EP13 is ideal for high performance, structural bonding applications. This durable, one component epoxy features both high tensile lap shear strength and compressive strength. EP13 is also serviceable up to 500°F, resists many harsh chemicals and is readily machineable.

For more information, request a technical data sheet on EP13
One Part Epoxy for Impregnation Applications
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Featuring superior flow properties, Master Bond EP19HT is ideal for high performance impregnation as well as bonding and coating applications with an exceptionally low viscosity of 300-700 cps. It has a remarkable strength profile and adheres well to a variety of substrates such as ceramics, metals, composites, glass and many plastics. This compound is also serviceable over the wide temperature range of -60°F to +400°F and is an outstanding electrical insulator.

For more information, request a technical data sheet on EP19HT
Rapid Curing, Silver Filled Epoxy Compound
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Well suited for demanding manufacturing applications, EP3HTS is a one part, electrically/thermally conductive epoxy system featuring a fast cure schedule of 40-90 minutes at 250°F or 20-40 minutes at 300°F. It offers a tensile lap shear strength of over 1,000 psi. This smooth, thixotropic paste has a service temperature range of -60°F to +400°F.

For more information, request a technical data sheet on EP3HTS
NASA Low Outgassing Approved B-Staged Epoxy Film for Bonding Applications
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FLM36-LO is a film adhesive featuring impressive strength properties, high temperature resistance, thermal conductivity and electrical insulation properties. Unlike many high temperature resistant adhesives, FLM36-LO features excellent flexibility and toughness, which enables it to resist rigorous thermal cycling. It is easy to apply and doesn’t require freezing. As an adhesive film, this system provides uniform bond line thicknesses.

For more information, request a technical data sheet on FLM36-LO
One Part Epoxy Adhesive Cures At 80°C
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Supreme 3HT-80 is a high strength, one component epoxy that features a 30 minute cure at 175°F (80°C) and a 10 minute cure at 250°F (121°C). It is well suited for difficult applications in the aerospace, electronic, electrical, computer and chemical industries. Supreme 3HT-80 is ideal for bonding heat sensitive substrates and can withstand rigorous thermal cycling. It produces outstanding shear and peel strength and is serviceable in the wide temperature range of -100°F to +350°F.

For more information, request a technical data sheet on Supreme 3HT-80
Low Viscosity, One Part UV Curable System
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Featuring enhanced toughness, UV15FL is an epoxy based system that has a cationic curing mechanism and is completely free of any oxygen inhibition. It has superior impact resistance as well as robust thermal cycling capabilities. This optically clear system also resists a wide variety of chemicals including water, acids, bases, fuels and many solvents.

For more information, request a technical data sheet on UV15FL

Master Bond

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