Bonding
Master Bond formulates a wide variety of one and two component industrial adhesive systems. Each compound is designed to meet specific performance requirements and is available for use in small to large sizes. Our line of formulations consists of epoxies, polyurethanes, silicones, polysulfides, cyanoacrylates and UV cure systems.
Bonding Substrates
Master Bond adhesive systems provide exceptional bonding strength to many similar and dissimilar substrates. Learn more about our adhesives for the following materials:
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Ceramics
Ceramics are non-metallic, inorganic materials noted for their wear/corrosion resistance, thermal stability, strength and good electrical insulation.
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Composites
Master Bond produces a variety of high performance adhesives for the assembly of composite products. Cutting-edge adhesive formulations are available for bonding fiber composites to themselves and numerous different substrates.
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Dissimilar Substrates
To achieve optimal adhesive strength for applications that involve bonding dissimilar substrates, many factors must be considered. Some include service conditions, joint design, curing, thermal, electrical and mechanical properties, and more. When bonding substrates with widely different thermal expansion coefficients (CTE) it is essential to consider these issues before choosing an adhesive system, to ensure that specific requirements are met.
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Glass
Cutting edge adhesive formulations are available for bonding glass to glass and to numerous other substrates including plastics, metals, and rubbers. These compounds are available as epoxies, silicones, polyurethanes, polysulfides, cyanoacrylates and UV/LED curing systems.
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Metals
From aluminum to cast iron to stainless steel to titanium, Master Bond one and two component adhesive systems meet the challenging needs of metal bonding applications.
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Plastics
Bonding plastic parts is increasingly recognized as a major challenge in many assembly operations. Master Bond has developed a comprehensive line of adhesive systems designed to bond plastic substrates to each other, as well as to metal, rubber, ceramic and glass.
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Polyolefins
Polyolefins are thermoplastic polymers that are used in an astounding variety of products. These versatile plastics are composed from monomers of ethylene or propylene.
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Rubbers
Master Bond has developed a comprehensive line of adhesives to bond rubbers to each other as well as to metals, plastics, ceramics and glass. These bonding compounds offer enhanced performance properties and easy application.
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Silicone Elastomers
Silicone substrates are most often bonded by the use of silicone adhesives. Adhesion can be enhanced by roughening or cleaning the parts to be bonded and through the use of silicone primers.
Key Benefits of Master Bond Adhesives
Our compounds utilize the most advanced polymeric materials and offer:
- Widest selection of formulations—over 3,000 grades
- Convenient cure schedules
- Advanced packaging for easy application
- Highest quality
- Latest technology
Learn more about our one and two component structural adhesives.
Performance Properties of Master Bond Adhesives
Our adhesives vary in viscosity, cure speed, mechanical, optical, electrical and thermal properties. Specific grades offer:
- High bond strength to a wide variety of surfaces
- Resistance to moisture and chemicals
- Exceptional durability
- Resistance to vibration, impact and shock
- High and low temperature resistance
Special formulations are available to meet strict industry standards including:
- NASA low outgassing specifications
- USP Class VI certification
- UL 94V-0 flame retardancy
- FDA CFR 175.300 food grade testing requirements
- Halogen free
Learn more about how surface wetting impacts adhesive bond strength.
Our Most Popular Adhesive Formulations
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Superior toughness. Ideal for bonding similar and dissimilar substrates. Withstands aggressive thermal cycling. Convenient one to one mix ratio. Good flow properties. User friendly. Versatile cure schedule. Serviceable from -60°F to +250°F.
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One part, oven cured epoxy system with excellent thermal conductivity and superb resistance to thermal cycling. Primarily used for bonding of heat sinks and sensors where heat transfer is desirable. Serviceable from 4k to +400°F. Convenient processing.
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Bonding, sealing, coating, potting compound. Heat, chemical, steam resistant. Superior optical transmission properties. Solvent free. Withstands exposure to acids, alkalis and many solvents. Castable up to 2-3 inches. Cures readily at ambient temperature. Service temperature range -60°F to +450°F.
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Epoxy adhesive, sealant, coating resists acids, alkalis and many solvents. Low viscosity room temperature curing. Contains no solvents. Serviceable from -60°F to +300°F. Castable to thicknesses exceeding 2-3 inches. Excellent electrical insulator.
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One part, oven curing epoxy system with very good adhesion to a wide range of plastics. Especially well suited for bonding dissimilar plastic materials. Resists -100°F to +350°F. Exceptional toughness. Successfully tested for 1,000 hours at 85°C/85% RH.
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UV curable system with superior resistance to chemicals, particularly solvents. High bond strength. Excellent light transmission properties. Electrical insulator. Low shrinkage upon cure. Exceptionally fast curing. Serviceable from -60°F to 250°F.
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Two part silicone paste for bonding and sealing applications. Outstanding flexibility. Low exotherm and long pot life system. Self priming feature. Contains no solvents or diluents. Superior electrical insulation properties. Can cure in wide sections vertically and horizontally. Serviceable from -65°F to +400°F
Latest Developments
Video
Medical Grade UV Curable Adhesive for TPU Bonding
While bonding thermoplastic polyurethanes (TPUs) is known to be challenging, Master Bond has formulated UV17Med, a UV curable adhesive specially formulated for TPU to TPU bonding. This compound passes ISO 10993-5 for cytotoxicity making it ideal for use in various medical device applications. Watch this video to learn more.
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Product Spotlight: UV22DC80-1
Master Bond UV22DC80-1 is a one part nanosilica filled system for bonding, sealing and coating applications in the aerospace, optical and electronic industries.
This video demonstrates the epoxy based system’s unique dual curing mechanism of both UV light and heat, allowing it to cure in shadowed out areas. This low viscosity epoxy passes NASA low outgassing testing and features exceptional optical clarity.
Case Study
EP21TDCS-LO: A Conductive Bonding Agent for Space-Environment Assemblies
Conductive bonding agents play a fundamental role in ensuring reliable electrical connectivity in many electromechanical assemblies designed to operate at the extremes of temperature and pressure of space. Failure of a single bond between conductive components in an assembly can ripple rapidly through mechanical and electrical systems, ultimately threatening spacecraft integrity and crew safety. In two applications, Master Bond EP21TDCS-LO conductive epoxy met critical requirements for maintaining robust bonds in electromechanical systems intended to operate in space conditions.
White Paper
Epoxy Innovations Drive Adhesive Bonding Growth
Whereas once mechanical fasteners may have been the assembly option of choice, tremendous strides in polymer chemistry over the past few decades have made epoxy resins technically and economically superior. In this white paper, we explore the various performance characteristics of adhesive technologies and their use in modern applications across many industries.
White Paper
Bonding Polyolefins The Easy Way
Polyethylene, polypropylene and related polyolefin blends and alloys have a reputation for being difficult to bond with conventional adhesives. However, advances in adhesive chemistry have made it possible to bond polyolefins effectively without the need for surface treatments. Learn more about the best practices for selecting the right adhesive for polyolefin bonding.
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Product Spotlight Supreme 18TC
This video demonstrates the ease of use and impressive properties of Master Bond Supreme 18TC, a one component smooth epoxy paste adhesive. Formulated with a blend of special thermally conductive fillers, this system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 BTU•in/ft2•hr•°F [3.17-3.61 W/(m•K)]. It can be used in a variety of high tech industries, including aerospace, electronic, optical, cryogenic and specialty OEM.
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