EP21TDCHT-1

Master Bond EP21TDCHT-1 is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures. It has a convenient and forgiving one to one mix ratio by weight. Upon mixing, for a 100 gram mass, the open time is 30-60 minutes. It cures at room temperature in 24-48 hours, or at 150-200°F in 1-2 hours. The optimum cure schedule is overnight at ambient temperature followed by 60-90 minutes at 150-200°F. It contains no solvents or diluents and has low shrinkage upon curing.

The system will bond well to a wide variety of substrates including metals, plastics, rubbers, glass and ceramics. EP21TDCHT-1 is a flexibilized system particularly well suited for bonding dissimilar substrates, especially where the substrates have different coefficients of expansion. EP21TDCHT-1 is an excellent electrical insulator and will resist most chemicals, including water, oils and many organic solvents. The service temperature range is outstanding, from -100°F to +400°F. EP21TDCHT-1 offers high shear and peel strength. This allows it to be used in a number of demanding situations including temperature cycling, high vibration and mechanical shock. EP21TDCHT-1 can be used in a range of applications including but not limited to structural, electronic, aerospace, medical and OEM. A non-drip version called E21TDCHTND-1 is also available.

Product Advantages

• Easy processing, non-critical 1:1 mix ratio
• Bonds well to a wide variety of substrates
• Toughened system, resists thermal cycling
• Dependable electrical insulation
• High peel strength and impact resistance