Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP15 One part epoxy for testing adhesion or cohesive strength of ceramic based flame-sprayed coatings Tensile Strength 12,000-14,000 psi Tensile Lap Shear Strength 2,600-2,800 psi	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding	40,000-65,000 cps	300-350°F for 60-90 minutes, with an optimum cure schedule of 60-90 minutes at 300-350°F plus post cure 4-6 hours at 300-350°F	80-90 Shore D	-60°F to +250°F	/de/tds/ep15
EP17HT-LO One component epoxy system for bonding, sealing, coating and casting Glass Transition Temperature (Tg) 200-210°C Tensile Lap Shear Strength 3,000-3,200 psi at 75°F	NASA Low Outgassing 1,000 Hours at 85°C/85% RH RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	45,000-75,000 cps	300°F for 4-6 hours, plus 12-24 hours at 350°F	80-90 Shore D	-80°F to +600°F	/de/tds/ep17ht-lo
EP3HT-LO One part, heat curing, no mix epoxy system Tensile Lap Shear Strength 1,600-1,800 psi Volume Resistivity >10¹⁴ ohm-cm	1,000 Hours at 85°C/85% RH NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	100,000-200,000 cps	250°F for 20-30 minutes or 300°F for 5-10 minutes, followed by 1 to 3 hours at 250 to 300°F	80-90 Shore D	-60°F to +400°F	/de/tds/ep3ht-lo
EP3HTS-TC One component, silver filled epoxy featuring extraordinary electrical and thermal conductivity Thermal Conductivity 110-118 BTU•in/(ft²•hr•°F) [16-17 W/(m•K)] Volume Resistivity <1x10⁻³ ohm-cm	RoHS Compliant NASA Low Outgassing	Bonding Die Attach Sealing Coating	paste	Cures rapidly at 250 to 300°F	60-70 Shore D	-80°F to +400°F	/de/tds/ep3hts-tc
EP3HTSDA-2 One component epoxy system featuring excellent electrical and thermal conductivity Thermal Conductivity 45-49 BTU•in/(ft²•hr•°F) [6.5-7 W/(m•K)] Volume Resistivity <0.001 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Die Attach Gap Filling Sealing Coating	>400,000 cps	250°F for 20-30 minutes, 300°F for 5-10 minutes, optimum cure schedule is either option above, plus 1 hour at 250-300°F	75-85 Shore D	-80°F to +450°F	/de/tds/ep3htsda-2
EP4EN-80 One component flowable epoxy for bonding and small encapsulation applications with a curing schedule at 80°C to 85°C Dielectric Constant 4.4 Thermal Conductivity 5.2-5.9 BTU•in/(ft²•hr•°F) [0.75-0.85 W/(m•K)]	NASA Low Outgassing RoHS Compliant	Bonding Encapsulation Potting	600-1,800 cps	90 minutes at 65°C plus 30 minutes at 80-85°C	85-95 Shore D	-58°F to +302°F	/de/tds/ep4en-80
EP5G-80 One component, graphite filled epoxy with a curing temperature of 80°C Glass Transition Temperature (Tg) 130-140°C Volume Resistivity 5-15 ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating	30,000-300,000 cps	4 hours at 80°C	75-85 Shore D	-58°F to +347°F	/de/tds/ep5g-80
EP5TC-80 One component thermally conductive, electrically insulating epoxy with a curing temperature of 80°C Dielectric Constant 4.6 Volume Resistivity >10¹² ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating	60,000-180,000 cps	80°C for 90-120 minutes with an optional post cure of 1-2 hours at 80°C to optimize properties	90-100 Shore D	-58°F to +302°F	/de/tds/ep5tc-80
Supreme 3HT-80 One component, toughened epoxy adhesive, sealant and coating Dielectric Constant 3.8 Tensile Lap Shear Strength 600-800 psi	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	70,000-150,000 cps	175-180°F 45-50 minutes, 250°F 20-30 minutes	75-85 Shore D	-100°F to +350°F	/de/tds/supreme-3ht-80
EP101HTX-3 One component epoxy system for impregnation, bonding, sealing and coating Glass Transition Temperature (Tg) 170-175°C Volume Resistivity >3 x 10¹⁴ ohm-cm	RoHS Compliant	Bonding Sealing Coating Impregnation	300-1,000 cps	6 to 8 hours at 300°F followed by 2 to 3 hours at 350°F	80-90 Shore D	-60°F to +500°F	/de/tds/ep101htx-3

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