Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP21FL Toughened, two component epoxy for bonding, sealing and encapsulation Tensile Modulus 150,000-200,000 psi Volume Resistivity 10¹⁴ ohm-cm	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Encapsulation Gap Filling Potting	2,000-4,500 cps	Optimum cure schedule: overnight at 75°F plus 2-3 hours at 150-200°F	40-50 Shore D	-100°F to +250°F	/de/tds/ep21fl
EP21FRNS-2 Two component epoxy system for potting, encapsulating and casting Dielectric Constant 4.5 Tensile Lap Shear Strength >1,200 psi	RoHS Compliant UL 94V-0 Flame Resistant	Casting Encapsulation Potting Sealing	Part A: 40,000-70,000 cps, Part B: 30,000-45,000 cps	Cures at 75°F, 48-72 hours	>75 Shore D	-59.8°F to +194°F	/de/tds/ep21frns-2
EP21H Two component epoxy compound for high performance applications Refractive Index 1.54 Volume Resistivity >10¹⁴ ohm-cm	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Encapsulation Potting Casting	3,000-6,000 cps	12-24 hours at 75°F, plus 3-4 hours at 150°F	>75 Shore D	-60°F to +250°F	/tds/ep21h
EP21HT Two component epoxy compound for high performance applications Dielectric Constant 2.90 Tensile Lap Shear Strength >3,000 psi	FDA Food Grade 21 CFR 175.105 RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 60,000-110,000 cps, Part B: 11,000-15,000 cps	Cures within 48-72 hours at 75°F	>75 Shore D	-60°F to +400°F	/de/tds/ep21ht
EP21HT-LO Two component epoxy compound for high performance applications Tensile Lap Shear Strength 2,800-3,000 psi. Volume Resistivity >10¹⁴ ohm-cm.	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating	Part A: 60,000-110,000 cps., Part B: 11,000-15,000 cps.	75°F: 48-72 hours; 200°F: 2-3 hours; Optimum cure schedule: overnight at 75°F, followed by 2 hours at 150-200°F.	75-85. Shore D	-60°F to +400°F.	/de/tds/ep21ht-lo
EP21HTFG Two component epoxy compound for high performance applications Tensile Lap Shear Strength >3,000 psi. Volume Resistivity >10¹⁴ ohm-cm.	RoHS Compliant FDA Food Grade 21 CFR 175.105	Bonding Sealing Coating Gap Filling	Part A: 60,000-110,000 cps., Part B: 11,000-15,000 cps.	Cures within 48-72 hours at 75°F.	>75 Shore D	-60°F to +400°F.	/tds/ep21htfg
EP21HTND Two component epoxy compound for bonding, sealing and coating Dielectric Constant 2.90 Volume Resistivity >10¹⁴ ohm-cm	FDA Food Grade 21 CFR 175.105 RoHS Compliant	Bonding Sealing Coating	Part A: paste, Part B: paste	Cures readily at 75°F or faster at elevated temperatures with the optimum being overnight at 75°F followed by 1-2 hours at 150-200°F.	>75 Shore D	-60°F to +400°F	/tds/ep21htnd
EP21LSCL-2 Two component, optically clear epoxy for bonding, coating, sealing and potting featuring superior non-yellowing properties and temperature resistance Dielectric Strength 440 volts/mil Refractive Index 1.57	RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Potting Casting Gap Filling Encapsulation	Part A: 1,500 - 2,500 CPS, Part B: 5 - 50 CPS	overnight at 75°F followed by 3-5 hours at 140-175°F	80-90 Shore D	-60°F to +350°F	/de/tds/ep21lscl-2
EP21LSCL-2Med Two component, optically clear epoxy for bonding, coating, sealing and potting featuring superior non-yellowing properties Dielectric Strength 440 volts/mil Refractive Index 1.57	ISO 10993-5 for Cytotoxicity RoHS Compliant	Bonding Sealing Coating Potting Encapsulation Gap Filling Underfill	600-900 cps	overnight at 75°F followed by 3-5 hours at 140-175°F	80-90 Shore D	-60°F to +350°F	/de/tds/ep21lscl-2med
EP21LV Two component, low viscosity epoxy compound Dielectric Strength 440 volts/mil Tensile Lap Shear Strength >2,800 psi	FDA Food Grade 21 CFR 175.105 RoHS Compliant	Bonding Sealing Coating Casting Encapsulation	10,000-13,000 cps	75°F: 24-48 hours	>70 Shore D	-65°F to +250°F	/de/tds/ep21lv

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