Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP21LV-LO Two component, low viscosity NASA low outgassing epoxy compound Dielectric Constant 2.79 Tensile Lap Shear Strength 2,600-2,800 psi	1,000 Hours at 85°C/85% RH RoHS Compliant NASA Low Outgassing	Bonding Sealing Coating Encapsulation Gap Filling Potting Casting	10,000-13,000 cps	overnight at 75°F followed by 2 hours at 150-200°F	70-80 Shore D	-65°F to +250°F	/de/tds/ep21lv-lo
EP21LVFL Two component, low viscosity epoxy for bonding, sealing, coating, and potting featuring good flexibility Elongation 120-150% Volume Resistivity >10¹⁵ ohm-cm	RoHS Compliant	Bonding Sealing Coating Encapsulation Gap Filling	10,000-14,000 cps	overnight at 75°F followed by 4-6 hours at 125-150°F	40-50 Shore D	-100°F to +250°F	/de/tds/ep21lvfl
EP21LVSP6 Two component epoxy for bonding, sealing, coating and encapsulating Dielectric Strength 450 volts/mil Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant MIL-STD-810G for Fungus Resistance	Bonding Sealing Coating Casting Encapsulation	Part A: 1,500-3,000 cps, Part B: 5,000-8,000 cps	75°F: 3-5 days; 200°F: 3-4 hours.	65-75 Shore D	-60°F to +250°F	/de/tds/ep21lvsp6
EP21LVTK-2 Two component epoxy system for bonding, sealing, coating, and casting Dielectric Strength 440 volts/mil Tensile Lap Shear Strength 2,800-3,000 psi	RoHS Compliant	Bonding Sealing Coating Encapsulation Potting Gap Filling	27,000-33,000 cps	overnight at 75°F, followed by a post cure at 150-200°F for 2-3 hours	>70 Shore D	-60°F to +250°F	/de/tds/ep21lvtk-2
EP21ND Two component epoxy compound for high performance applications Dielectric Constant 2.92 Tensile Lap Shear Strength >2,500 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	48-72 hours at 75°F	>70 Shore D	-60°F to +250°F	/de/tds/ep21nd
EP21ND-2 Two component epoxy compound for high performance applications Dielectric Constant 2.92 Tensile Lap Shear Strength >2,500 psi	RoHS Compliant	Bonding Sealing Coating	paste	75°F: 48-72 hours; 200°F: 2-3 hours; Optimum cure schedule: 12-24 hours at 75°F, plus 2 hours at 150-200°F	>70 Shore D	-60°F to +250°F	/de/tds/ep21nd-2
EP21ND-LO Two component, non-drip epoxy system for bonding, sealing and coating applications Dielectric Constant 2.92 at 75°F, 60 Hz Tensile Lap Shear Strength >2,500 psi at 75°F	NASA Low Outgassing RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	12-24 hours at 75°F, plus another 2 hours at 150-200°F	>70 Shore D	-60°F to +250°F	/de/tds/ep21nd-lo
EP21ND-LP Two component epoxy compound for high performance applications featuring convenient handling and a long working life Dielectric Constant 2.92 Tensile Lap Shear Strength 2,600-2,800 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	75°F: 3-4 days; 150-200°F: 3-4 hours; Optimum cure schedule: 12-24 hours at 75°F, plus 3 hours at 150-200°F	70-80 Shore D	-60°F to +250°F	/de/tds/ep21nd-lp
EP21NDCL Two component epoxy compound for high performance bonding, sealing and coating Tensile Lap Shear Strength 2,600-2,800 psi Volume Resistivity >10¹⁴ ohm-cm	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Gap Filling	paste	75°F: 48-72 hours	70-80 Shore D	-60°F to +250°F	/tds/ep21ndcl
EP21NDFG Two component epoxy compound for high performance applications Tensile Lap Shear Strength >2500 psi Volume Resistivity >10¹⁴ ohm-cm	FDA Food Grade 21 CFR 175.105 RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	48-72 hours at 75°F	>70 Shore D	-60°F to +250°F	/de/tds/ep21ndfg

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