EP21AOHTLV

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Two Component Heat Resistant Epoxy Adhesive, Sealant, Encapsulant With High Thermal Conductivity, and Excellent Dimensional Stability Up to 400°F Service

Typical Properties
Viscosity
low viscosity
Cure Schedule
85% of maximum strength developed within 24-48 hours
Service Temperature Range
-60°F to +400°F
Coefficient of Thermal Expansion
36 in/in/°C X 10⁻⁶
Dielectric Constant
3.9 at 75°F, 60 cycles; 3.7 at 75°F, 106 cycles
Dissipation Factor
0.018
Thermal Conductivity
10 BTU•in/(ft²•hr•°F)
Bild
EP21AOHTLV Two Part Epoxy
Applications
Product Description

Master Bond Polymer Adhesive EP21AOHTLV is a low viscosity two component heat resistant epoxy adhesive, sealant and encapsulant formulated to cure at room temperature or more rapidly at elevated temperatures, with a one- to-one mix ratio,weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents) over the exceptionally wide temperature range of -60°F up to more than 400°F. Adhesion to metals, glass, ceramics,wood, vulcanized rubbers and many plastics is excellent. EP21AOHTLV has good flowability and can be used as a potting compound where medium and large size castings are required. The hardened adhesive exhibits high thermal conductivity and is an electrical insulator. The thermal expansion coefficient is remarkably low. Color of part A gray, part B amber. Master Bond EP21AOHTLV adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

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How to order

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Your adhesive will be made to order and shipped to you. Typical lead times are 10-14 business days, with rush options available for urgent orders.