EP30-2SP

Master Bond Polymer System EP30-2SP is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/25 mix ratio by weight. This resin system is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit superior dimensional stability. Shrinkage upon cure is exceptionally low - 0.0003 incheses/inch.

Master Bond Polymer System EP30-2SP produces high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60°F to more than 250°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened resin is an electrical insulator. Color of parts A and B are clear. Master Bond Polymer System EP30-2SP is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.